Ppg Industries Ohio, Inc.

Ppg Industries, Inc.

Prc De Soto International, Inc.

Pp6 Industries Ohio, Inc.

Michael J Pawlik

Ralph C Gray

Richard M Nugent, Jr

Dennis W Jones

Robin M Peffer

Edward Francis Rakiewicz

Michael Allen Mayo

Ellor James Van Buskirk

Gregory J McCollum

Richard F Karabin

Alan J Kaylo

Craig A Wilson

James E Poole

Michael G Sandala

Shanti Swarup

Jerome A Seiner

Noel Rawle Vanier

Xiangling Xu

Cynthia Kutchko

Alan E Wang

Calum Hugh Munro

Kevin C Olson

Robert R Zwack

Joseph Theodore Valko

Paul J Prucnal

Wei Wang

Eric L Morris

Nathan J Silvernail

Jane Valenta

Roy E Dean

Charles F Kahle, Ii

Victor G Corrigan

Thor G Lingenfelter

Steven D Perrine

Kelly Moore

Gordon L Post

Yves Le Disert

Laurent Deronne

James E Jones

Edward E Abbott

Kathleen M Coldren

Valentin Berger

David B Asay

Richard F Syput

Philippe Faucher

Michael L White

Michelle S Miles

Jonathan G Weis

Kevin J Dufford

Qi Ding

Matthew William Skinner

Daniel L Hopkins

Kelly L Mardis

Paul J Pruchal

Christopher J Baldy

Michael J Allaway

Hyun Wook Ro

Samuel L Esarey

Caitlyn B Neidig

Larry J Ruffaner

Inanllely Y Gonzalez

Pawel M Krys

Matthew W Skinner

Methods for treating a substrate are disclosed. The substrate is deoxidized and then immersed in an electrodepositable pretreatment composition comprising a lanthanide series element and/or a Group IIIB metal, an oxidizing agent, and a metal-complexing agent to deposit a coating from the electrodepositable pretreatment composition onto a surface of the substrate. Optionally, the electrodepositable pretreatment composition may comprise a surfactant. A coating from a spontaneously depositable pretreatment composition comprising a Group IIIB and/or Group IVB metal may be deposited on the substrate surface prior to electrodepositing a coating from the electrodepositable pretreatment composition. Following electrodeposition of the electrodepositable pretreatment composition, the substrate optionally may be contacted with a sealing composition comprising phosphate and a Group IIIB and/or IVB metal. Substrates treated according to the methods also are disclosed.

Treated substrates

Graphenic carbon nanoparticles that are dispersed in solvents through the use of dispersant resins are disclosed. The graphenic carbon nanoparticles may be milled prior to dispersion. The dispersant resins may comprise a polymeric dispersant resin comprising an addition polymer comprising the residue of a vinyl heterocyclic amide, an addition polymer comprising a homopolymer, a block (co)polymer, a random (co)polymer, an alternating (co)polymer, a graft (co)polymer, a brush (co)polymer, a star (co)polymer, a telechelic (co)polymer, or a combination thereof. The solvents may be aqueous, non-aqueous, inorganic and/or organic solvents. The dispersions are highly stable and may contain relatively high loadings of the graphenic carbon nanoparticles.

Dispersions containing graphenic carbon nanoparticles and dispersant resins

Methods for electrolytically depositing pretreatment compositions

The invention includes a method of preparing an aqueous dispersion of particles at least partially encapsulated by a polymer, the method comprising dispersing inorganic particles in an aqueous phase; functionalizing at least a portion of the surfaces of the inorganic particles with a coupling agent, the coupling agent having pendent reactive groups; polymerizing the reactive groups on the functionalized particles with a first polymerizable component to produce inner polymer shells surrounding the inorganic particles; polymerizing a second polymerizable component to form outer polymer shells at least partially encapsulating the inner polymer shells; and producing voids within the outer polymer shells, such that the inorganic particles are received within the voids.

Opacifying particles with internal void and methods for making the same

Disclosed is a method of producing metal oxides, comprising electrodepositing a metal oxide from an electrolyte solution onto a substrate to coat at least a portion of the substrate, whereby metal oxide seed particles are released into the solution, and precipitating metal oxide particles from the solution. The precipitated metal oxide particles have a maximum particle size of less than 1 micron.

Electrolytic production of metal oxides

A process for applying a coating on aluminum substrates by anionic or cationic electrodeposition of an electrodeposition coating including an aqueous dispersion of one or more lanthanide series elements having a +3/+4 oxidation state and phosphated epoxy resin made by phosphating a polyepoxide with both phosphoric acid and an organophosphonic acid and/or an organophosphinic acid. The coating has a reduced tendency to form pinholes.

Electrodeposition coatings including a lanthanide series element for use over aluminum substrates

Disclosed herein are electrodepositable coating compositions comprising a film forming resin and a textured additive, wherein the textured additive has a density (specific gravity) of no more than 4.5 g/cc and a melting point greater than the curing temperature of the electrodepositable coating composition. Also described are coated substrates having a cured coating layer comprising the electrodepositable coating composition, wherein the cured film layer has a texture of at least 250&#x3bc;-in as measured by a profilometer at conventional cured film thicknesses.

Near neutral buoyancy texture additive for electrodepositable coating compositions and associated methods for forming textured coated substrates

A substrate includes an iron-nickel alloy core or a cobalt-nickel ferrous alloy core, a chromium conversion coating on at least a portion of the core, and an insulating coating on the chromium conversion coating. A method of making a substrate includes: providing an iron-nickel alloy core or a cobalt-nickel ferrous alloy core, applying a chromium conversion coating on at least a portion of the core, and applying an insulating coating on the chromium conversion coating.

Passivated metal core substrate and process for preparing the same

The present invention is directed to an electrodepositable coating composition comprising a bismuth salt and a stabilizing agent, and wherein the molar ratio of elemental bismuth to the stabilizing agent is not less than 1:0.25.

Electrodepositable coating composition comprising a bismuth salt and a stabilizing compound

An electrode assembly for use in electrophoretically depositing an electrodepositable coating composition onto a conductive substrate having a hollowed interior region therewithin includes a first counter electrode and an electrode assembly comprising a second counter electrode and a deployable primary electrode which are introduced within the hollowed out interior region during the electrodeposition process to provide a deposited electrodeposition coating on inner and outer surfaces.

Electrode configurations for coating interior and exterior surfaces of conductive substrates in an electrodeposition coating process

The present invention is directed to an electrodepositable coating composition comprising a non-solubilized zinc compound in an amount of at least 0.61 weight % based on the total resin solids of the electrodepositable coating composition.

Electrodepositable coating composition comprising a non-solubilized zinc compound

A composition for use in electrodeposition includes a resin blend, a coalescing solvent, a catalyst, water, and a highly cross-linked microgel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel. Another composition for use in electrodeposition includes a surfactant blend, a low ion polyol, phenoxypropanol, a catalyst, water, a flexibilizer, and a highly cross-linked microgel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel.

Electrodeposition of dielectric coatings on semiconductive substrates

A method includes: immersing a semiconductive substrate in an electrodeposition composition, wherein at least 20 percent by weight of resin solids in the composition is a highly cross-linked microgel component, and applying a voltage between the substrate and the composition to form a dielectric coating on the substrate. A composition for use in electrodeposition includes a resin blend, a coalescing solvent, a catalyst, water, and a highly cross-linked migrogel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel. Another composition for use in electrodeposition includes a surfactant blend, a low ion polyol, phenoxypropanol, a catalyst, water, a flexibilizer, and a highly cross-linked migrogel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel.

A process for fabricating a circuit board includes: providing a substrate including a first electrically conductive core having a first insulating coating on a first side and a second insulating coating on a second side, forming an opening in the first and second insulating coatings and the first electrically conductive core, exposing an edge of the conductive core within the opening, and electrodepositing a third insulating material on the exposed edge of the first electrically conductive core. A circuit board fabricated using the process is also provided.

Process of fabricating a circuit board

Growing community of inventors

Glenshaw, PA, United States of America

Michael J Pawlik