International Business Machines Corporation

Other

Michael J Palmer

Raymond R Horton

Ismail C Noyan

Alphonso Philip Lanzetta

Ho-Ming Tong

Timothy C Reiley

Sung Kwon Kang

Kurt R Grebe

Harry R Bickford

Mark F Bregman

Linda C Matthew

Robert D Topa

Bernardo Hernandez

Chandrasekhar Narayan

Caroline A Kovac

Claudius Feger

Mark B Ritter

Teresita Ordonez Graham

Charles H Wilson

Helen L Yeh

John J Liutkus

Frederick G Weindelmayer

Paige A Poore

Nelson R Tanner

Sampath Purushothaman

Paul Andrew Moskowitz

David Lee Rath

Thomas Mario Cipolla

Hiroshi Ito

Martin J Goldberg

Roger Alan Pollak

William D Brewer

Bernie Hernandez

John C Zyzo

Peter Alfred Gruber

Lawrence Shungwei Mok

Michael John Brady

James Gardner Ryan

Arthur R Zingher

Thomas George Ference

Erick G Walton

Pedro A Chalco

Philip Murphy

William Edward Pence, Iv

Stanley D Yeatts, Ii

William E Pence, Iv

Ismail C Novan

Ismail Gevdet Noyan

The invention provides a wiring conductor for densely packed electronic apparatus, on which there is a supporting body of a material with randomly intertwined and fused filaments with spacing for being permeated by a coolant. The filamentary body material in addition may have imparted thereto the physical properties of interdependent density and permeability, noncorrosiveness and electrical conductivity.

Lightweight electronic equipment conductor with coolant permeable support

A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.

Coated means for connecting a chip and a card

In alignment of superpositioned objects on opposing substrates accuracy and simplicity is achieved through relative movement of the substrates responsive to an image of one object reflected from the surface of the opposite substrate. Alignment of mating fine pitch conductors and pads for bonding is achieved by observation of the reflection of one conductor or pad in the surface of the opposite substrate and relatively moving the substrates to eliminate the reflection.

Optical alignment of superpositioned objects

A device and method are provided for clamping and severing a compressible structure containing a fluid. A clamp having a pair of arms is secured in a clamped position about the structure so that the fluid between the arms is forced outward therefrom. A cutting assembly coupled to the clamp cuts through the pair of arms while in the clamped position to form first and second separated clamps that remain in the clamped position. As a result, the structure is severed and clamped without fluid discharge.

Compressible structure clamping and cutting

Thin film diffusion bonding of lead assemblies under severly limited spacing, thermal and pressure conditions is achieved through application of precisely controlled energy at the bond interface. The precisely controlled energy is a laser thermosonic energy pulse, delivered through a cleaved optical fiber end and closed end tip, that produces a heat increment in excess of the steady state manufacturing design temperature for the assembly and which is applied directly at the bond interface.

Diffusion bonding of lead interconnections using precise

A high efficiency thermal interposer comprising a first hollow disk and second hollow disk, held together by thermally isolating fasteners. The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk; but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means for introducing cold jets of air into the cavity containing the particles, means for circulating the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity. The novel thermal interposer has a low mass, is compact and can achieve a temperature drop that will permit high powered HAT devices to be used in conjuction with temperature sensitive electronic orientation means, such as robot arms.

High efficiency thermal interposer

The invention provides lightweight packaging of portable electronic apparatus by using the combined structural properties of an enclosure, that houses the interwired heat producing electronic signal devices of the apparatus, to provide coolant movement and direction, locally selectable physical protection and shock resistance and electrical shielding. It achieves the packaging benefits by having;

Lightweight packaging

Process for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.

Electronic packaging shaped beam lead fabrication

An electronic packaging interface between conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.

In a bonding station, a tooling principle is provided wherein first and second tool parts respectively hold first and second apparatus parts, each apparatus part having fine conductor periodicity edge bonding regions, in superpositioned registration with the tool parts providing space and accessability for optical alignment and for bonding heat and pressure. The tool members retain a first, position registered, apparatus part, with 'X' - 'Y' registration capability, in position with an edge bearing a fine conductor periodicity accessable by a tapered edge of the tool which permits optical fine alignment adjustment and bonding heat and pressure application.

Fine pitch bonding

Apparatus for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.

Apparatus for multilayer conductor chip packaging

A castellated nozzle for connecting a plurality of microelectronic leads to an associated plurality of contact pads and method of using the same. The castellated nozzle includes a body having a plurality of castellations protruding therefrom, with each of the castellations having a contact surface thereon. A channel is formed adjacent to at least one castellation of the plurality of castellations. An opening extends through the body for introducing a heated gas therein. The contact surfaces of the plurality of castellations are aligned to a respective plurality of leads. Typically, the castellated nozzle includes a first plurality of castellations forming a first row and a second plurality of castellations forming a second row.

Castellated nozzle and method of use thereof

In a bonding station the parts of the apparatus to be bonded are retained at a thermal bias temperature at a permitted level and a thermal check valve interface is provided between the bonding location and the part of the station that would serve as a conduction heat sink, thereby thermally insulating other uninvolved parts of the structure and and confining the bonding heat to the bonding region. Such confinement reduces the dwell time that the bond must remain at the bonding temperature. The bonding station has a number of features: the parts to be bonded are maintained on a support member that is provided with a heat biasing capability that can establish the assembly at a specified temperature; a retention capability, such as the use of vacuum, is provided to maintain registration and thermal contact of the part with the support; and a thermal check valve capability is provided to control the rate of heat flow through the support member so that locallized heat is controlled in dissipation.

Controlled temperature bonding

A castellated nozzle for connecting a plurality of microelectronic leads to an associated plurality of contact pads and method of using the same. The castellated nozzle includes a body having a plurality of castellations protruding therefrom, with each of the castellations having a contact surface thereon. A channel is formed adjacent to at least one castellation of the plurality of castellations. An opening extends through the body for introducing a heated gas therein. The contact surfaces of the plurality of castellations are aligned to a respective plurality of leads. Typically, the castellated nozzle includes a first plurality of castellations forming a first row and a second plurality of castellations forming a second row. A channel is formed adjacent to at least one castellation. The first and second plurality of castellations are arranged in a staggered format wherein at a first point along the length of the opening one of the castellations in the first row is located opposite to one of the channels of the second row, and wherein at a second point along the length of the opening one of the channels in the first row is located opposite to one of the castellations in the second row. An opening is formed between the first and second row. The castellated nozzle includes a hole for aligning the castellated nozzle to a flexible circuit carrier.

Castellated nozzle and method of use therof

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Walden, NY, United States of America

Michael J Palmer