Lockheed Martin Corporation

Bae Systems Information and Electronic Systems Integration Inc.

Michael J O'Connor

Jonathan Wesley Ward

Garo Jacques Derderian

Mitchell Meinhold

Keith K Sturcken

Adrian N Robinson

Kenneth J Cross

A hermetically sealed electronics module includes a core IC installed on a substrate. A collar surrounds the core IC and is sealed to the substrate and to a lid, forming a sealed chamber. A heat spreader bonded to an internal surface of the lid extends downward into proximal thermal contact with the core IC. A thin layer of TIM can be applied between the heat spreader and core IC. The heat spreader does not overlap any tall components that extend above the core IC, and can extend over regions adjacent to the core IC. Tall components can be limited to a periphery of the chamber, and/or the heat spreader can include openings that surround central tall components. The heat spreader can be soldered or welded to the lid over an entire upper surface of the heat spreader. X-ray and/or CSAM scanning can detect heat spreader bonding flaws.

Hermetically sealed electronics module with enhanced cooling of core integrated circuit

Identifying marks are often used for authentication and tracking purposes with various types of articles, but the marks themselves can sometimes be subject to replication or removal by an outside entity, such as a person or group having malicious intent. This can make it easier for an outside entity to produce a counterfeit article or to sell a stolen article. Carbon nanotubes and other carbon nanomaterials can be used to form identifying marks that are not visible to the naked eye, thereby making the marks more difficult for an outside entity to tamper with. Various articles can include an identifying mark that is localized and not visible to the naked eye, the identifying mark being electrically conductive and containing a carbon nanomaterial. By electrically interrogating the article, such as through spatially measuring eddy currents about the article, the marks can be located and authenticated.

Articles containing non-visible identifying marks formed from carbon nanomaterials and methods utilizing the same

Methods for fabricating graphene nanoelectronic devices with semiconductor compatible processes, which allow wafer scale fabrication of graphene nanoelectronic devices, is provided. One method includes the steps of preparing a dispersion of functionalized graphene in a solvent; and applying a coating of said dispersion onto a substrate and evaporating the solvent to form a layer of functionalized graphene; and defunctionalizing the graphene to form a graphene layer on the substrate.

Graphene nanoelectronic device fabrication

Embodiments of the present invention provide methods for fabricating graphene nanoelectronic devices with semiconductor compatible processes, which allow wafer scale fabrication of graphene nanoelectronic devices. Embodiments of the present invention also provide methods for passivating graphene nanoelectronic devices, which enable stacking of multiple graphene devices and the creation of high density graphene based circuits. Other embodiments provide methods for producing devices with graphene layer segments having multiple thicknesses.

Graphene nanoelectric device fabrication

A two terminal switching device includes a first conductive terminal, a second conductive terminal in spaced relation to the first terminal, the first terminal encompassed by the second terminal. The device also includes an electrically insulating spacer that encompasses the first terminal and provides the spaced relation between the second terminal and the first terminal. It also includes a nanotube article comprising at least one carbon nanotube, the nanotube article being arranged to overlap at least a portion of each of the first and second terminals. The device also includes a stimulus circuit in electrical communication with at least one of the first and second terminals that is capable of applying a first electrical stimulus to at least one of the first and second terminals to change the resistance of the device between the first and second terminals from a relatively low resistance to a relatively high resistance.

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Manassas Park, VA, United States of America

Michael J O'Connor