Advanced Interconnections Corporation

Michael J Murphy

James V Murphy

Glenn Goodman

Robert N Taylor

Gary D Eastman

Curtis M Wilmot

Ronald R Lambert

Burton Fisher

An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes a socket terminal having a first end, and a second end opposed to the first end. An axial hole extends inward from the second end, and an electrically conductive core member is disposed within the axial hole. The core member is formed of a different material than the socket terminal body, and is sized and shaped to obstruct the hole. In addition, the first end of the socket terminal is configured to receive a pin terminal, and the second end of the socket terminal is configured to be received within a hole in a printed circuit board.

Terminal assembly with regions of differing solderability

An electrically conductive terminal is configured for insertion into an opening in a substrate. The terminal includes a body having proximal and distal ends. The distal end is configured for insertion into the opening. The body includes a wall having an outer surface and a compliant barb that includes a base portion, an apex portion, a barb inner surface, and a barb outer surface. The base portion is disposed on the outer surface of the wall, along the body. The apex portion extends from the base portion in a direction from the distal end to the proximal end at an angle from the wall outer surface. The apex portion is located between the base and the proximal end. The barb inner surface faces the wall outer surface. The barb inner surface and the barb outer surface converge to the apex so that the cross-sectional width of the barb is non-uniform.

Terminal with compliant barb

A connector assembly configured to electrically connect a first substrate with a second substrate is provided. The connector assembly includes an insulating support member including an array of apertures, and terminal assemblies disposed in the apertures. Each terminal assembly includes a hollow cylindrical body, and first and second terminals disposed on opposed ends of the body. The body is split by an opening extending between opposed ends, and resiliency of the body biases the first and second terminals in opposed directions along the longitudinal axis.

Split ring terminal assembly

A socket terminal assembly is configured to electrically connect a contacting area of an integrated circuit with a corresponding connection region of a substrate, the socket terminal assembly comprising a socket shell including a first end configured to contact the corresponding connection region of the substrate and a second end defining a first open cavity; a pin including an end defining a second open cavity; and a coiled spring interposed between the socket shell and the pin, the spring including a first end section received within the first open cavity and a second end section received within the second open cavity.

Low profile LGA socket assembly

A ball grid array socket assembly consists of a socket body having a plurality of vias extending through the socket body between upper and lower surfaces thereof, a plurality of electrically conductive contact assemblies respectively disposed in corresponding vias, and a releasable cover assembly. Each of the contact assemblies includes a lower terminal end projecting outwardly from the lower surface of the body for engaging a terminal pad on a circuit board, and further includes an upper multi-fingered contact arrangement for engaging a ball contact of a ball grid array package. Three separate embodiments of the contact assemblies are disclosed. In use, the ball grid array package is received in assembled relation with the socket body adjacent the upper surface thereof wherein the ball contacts of the ball grid array package are received into the vias in engaging electrical communication with the upper contact ends of the contact assemblies. The multi-fingered upper ends of the contact assemblies engage the BGA ball contact at multiple points to reduce creep associated failure of the contact, while a pivoting contact body portion provides relative movement between the BGA contact ball and the circuit board substrate to reduce thermal expansion stresses. The lower end of the contact assembly may comprise a removable, pivotable post which permits visual inspection of the terminal post solder joint on the terminal pad of the circuit board.

Ball grid array socket assembly

The disclosure features lead frames, molded lead frames and adapters and sockets produced by molding these lead frames. In general, the lead frames comprise a frame and a circuit, wherein the circuit comprises a plurality of electrical conducting elements. The elements are held in position by the frame, and each element comprises an area within the element suitable for positioning a pin through the element to electrically connect the element with the board. The lead frame can be molded in plastic and trimmed to remove the frame to leave each element electrically separate from each other element.

Molded-in lead frames

A socket for connecting a first component to a circuit board. The socket includes pins for connection between the component and the board and a pair of lead frame regions, which are each electrically connected to at least one pin. Each of these regions includes a connection region for making connections to a second component. Insulative plastic is molded around the regions and defines holes through which the pins are inserted. A receptor opening is provided for receiving the second component. The first component may be an integrated circuit, the second a chip capacitor, and the socket may be a DIP socket. The capacitor may be soldered to the connection regions exposed through the receptor opening. Centering bumps may align the capacitor. The plastic may define an exposed area where each of the lead frame regions connects to respective pins, allowing for inspection of the connection between lead frame regions and respective pins.

Socket constructed with molded-in lead frame providing means for

An adapter for connection of an integrated circuit package to a circuit board, the package being of the type having solder leads, and the adapter comprising a plurality of pins for connection to the circuit board, a plurality of lead frame elements, each lead frame element connected to a pin, and each lead frame element including a connection region sized and positioned for making a solder connection to a lead of an integrated circuit package, and insulative plastic molded around the pins and lead frame elements, the molded plastic body having a shape providing a plurality of grooves that each expose a connection region of one of the lead frame elements and that serve to align the solder leads with the connector regions.

Growing community of inventors

East Greenwich, RI, United States of America

Michael J Murphy