The Dow Chemical Company

Dow Global Technologies LLC

Merrell Pharmaceuticals, Inc.

Blue Cube IP LLC

Merrell Dow Pharmaceuticals

Other

Virginia Polytechnic Institute and State University

Michael J Mullins

Alan D Cardin

H Craig Silvis

Clark H Cummins

Thoi H Ho

Edmund P Woo

Robert E Hefner, Jr

Mark B Wilson

Richard L Jackson

Wendy D Hoenig

Che-I Kao

Thomas A Chamberlin

Ray E Drumright

Michael E Rowland

William A Fordyce

Bharat Indu Chaudhary

David A Babb

Michael J Fazio

Bernd Hoevel

Guillaume Metral

Teresa Plumley Karjala

Peter N Nickias

Joseph Gan

Daniel J Murray

Stephen E Bales

Muthiah N Inbasekaran

Jorge Soto

Robert H Terbrueggen

Stephanie L Potisek

Ulrich Herold

Norton P Peet

Ludovic Valette

Angela I Padilla-Acevedo

Andrew N Paquet

Steven P Crain

William B Marshall

Kandathil Eapen Verghese

Anteneh Z Worku

Rafael Galvan

Edvins L Daiga

Yu Cai

Francis J Timmers

Roger L Kuhlman

Hongyu Chen

William Jack Kruper, Jr

Maurice J Marks

James E McGrath

R Vernon Snelgrove

Phillip S Athey

Michael Leo Tulchinsky

Seema V Karande

William J Kruper

Endre Szuromi

Li-Min Tau

Harold W Boone

Hendrik E Tuinstra

John J Kester

Hung-Jue Sue

James M Roe

Kamesh R Vyakaranam

Robert J Wright

Chao Zhang

Andy I Laiho

Steven J Guillaudeu

Johann-Wilhelm Frey

Philip J Brondsema

Ashwin R Bharadwaj

Jiawen Xiong

Joey W Storer

Percy J Hamlin

Ernesto Occhiello

Simon Ye

Che-l Kao

Cheng-Cheng C Chen

Edmond P Woo

Daniel M Knauss

Kimberly E Balon

Tianhui Xiao

Frank Y Gong

Wayne Yi Zhang

Raymond J Thibault

Annie Liao

Kandathil E Verghese

Tomoyuki Aoyama

Perrin Shaoping Ren

Annie Guihong Liao

Embodiments include curable compositions including an epoxy resin and a hardener component including a polymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 0.5:1 to 5:1. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.

Curable compositions

A process for making a phosphorus-containing compound is disclosed. The process comprises contacting a compound of formula (A) wherein Rand Rare selected from optionally substituted aryl, aryloxy, alkyl and alkoxy groups or can be combined to form cyclic structures; and Ris methyl, ethyl, isopropyl, n-butyl, i-butyl, t-butyl, phenyl or benzyl; and a compound of formula (B) wherein R-Rare selected from optionally substituted aryl, aryloxy, alkyl and alkoxy groups. The phosphorus-containing compound can then be used as a flame retardants for polymers, especially for epoxy, polyurethane, thermosetting resins and thermoplastic polymers. Such flame retardant-containing polymers can be used to make protective coating formulations and ignition-resistant fabricated articles, such as electrical laminates, polyurethane foams, and various molded and/or foamed thermoplastic products.

Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers

A novel low viscosity epoxide having the following general Structure (I): Structure (I) wherein R1 and R2 can be, but is not limited to, hydrogen or a hydrocarbon group having from C1 to about C20 carbon atoms; with the proviso that R1 and R2 are not both hydrogen. 

Epoxide compound

A process for making a phosphorus-containing compound is disclosed. The process comprises contacting a compound of formula (A) wherein Rand Rare selected from optionally substituted aryl, aryloxy, alkyl and alkoxy groups or can be combined to form cyclic structures; and Ris methyl, ethyl, isopropyl, n-butyl, i-butyl, t-butyl, phenyl or benzyl; and a compound of formula (B) wherein R-Rare selected from optionally substituted aryl, aryloxy, alkyl and alkoxy groups. The phosphorus-containing compound can then be used as a flame retardants for polymers, especially for epoxy, polyurethane, thermosetting resins and thermoplastic polymers. Such flame retardant-containing polymers can be used to make protective coating formulations and ignition-resistant fabricated articles, such as electrical laminates, polyurethane foams, and various molded and/or foamed thermoplastic products. 

A curable composition comprising (a) at least one low viscosity epoxide resin compound having the following chemical structure: (I) wherein Rand Rare hydrogen or a hydrocarbon group having from 1 to 20 carbon atoms, with the proviso that Rand Rare not both hydrogen, and (b) at least one curing agent or UV photoinitiator; and a thermoset prepared from the above curable composition. 

Curable compositions and thermosets prepared therefrom

A curable resin composition including (I) at least one thermoset resin composition; and (II) at least one hardener; wherein the powder coating has a balance of properties including a combination of high glass transition temperature and low water absorption.

Coating compositions

Embodiments of the present disclosure provide a composition that includes a phosphorous-containing compound, a cyanate ester, an epoxy resin, and a maleimide. For the various embodiments, a viscosity of the composition increases less than 100% as measured by Gardner Bubble Viscosity a temperature of 23&#xb0; C. in at least 3 days. For the various embodiments, the composition of the present disclosure can also include an aprotic solvent, such as a ketone. Embodiments of the present disclosure further include a composition that includes the phosphorous-containing compound, the cyanate ester, and the aprotic solvent. For the various embodiments, the composition can also include the epoxy resin and the maleimide. For the various embodiments, the composition does not include an aliphatic alcohol.

Compositions having phosphorus-containing compounds

Aromatic dicyanate compounds which comprise aliphatic moieties having at least about six carbon atoms and resins and thermoset products based on these compounds.

Aromatic dicyanate compounds with high aliphatic carbon content

A solvent-free curable epoxy resin composition including (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the solvent-free curable epoxy resin composition is substantially free of solvent and has at least two exotherm peaks and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable solvent-free epoxy resin composition of being B-staged.

Curable resin compositions

A curable epoxy resin composition including (a) at least one epoxy resin; and (b) at least one hardener; wherein the curable epoxy resin composition has at least two exotherm peaks representing at least two distinct chemical reactions and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable epoxy resin composition of being B-staged.

A curable resin composition for composites and electrical laminates including (I) at least one thermoset resin composition; (II) at least one hardener; and (III) at least one reinforcing material; wherein the composite or electrical laminate has a balance of properties including a combination of (a) a Tg of at least about 150&#xb0; C.; and (b) a water uptake of less than about 2.5 wt %.

Composite compositions

An epoxy resin composition prepared from a dihydroxydiphenyl-cycloalkane compound to form a diglycidyl ether of dihydroxydiphenyl cycloalkane compound which may be useful for making various products including, for example, powder coatings, composites and electrical laminates.

Epoxy resin compositions

A multifunctional aromatic amine hardener composition including the reaction condensation product of (a) at least one aniline and (b) at least one non-aromatic cyclic dicarboxaldehyde; and a reactive thermosettable resin composition including (i) at least one multifunctional aromatic amine hardener composition curing agent, (ii) at least one thermoset resin, and optionally (c) at least one catalyst; and a process for preparing a thermoset product from the thermosettable composition. The hardener composition above and a thermoset resin may be used to prepare a thermoset product with improved thermo-mechanical behavior.

Hardeners for thermosettable resin compositions

Growing community of inventors

Houston, TX, United States of America

Michael J Mullins