Delco Electronics Corporation

Michael J Luettgen

Mark Billings Kearney

Dennis Michael Koglin

Ronald E Brown

John M Hart, Jr

A pressure sensor includes a three part package including a housing member defining two spaced-apart chambers, a bottom member providing the bottom wall of one of the chambers, and a top cover member hermetically sealing the two chambers from one another and including a port for admission of gases into one of the chambers. A pressure sensing element is disposed in the chamber having the port and mounted on the bottom member, and a signal processing element is mounted in the other chamber. Electrical connections between the two elements are by means of leads which extend into each chamber and pass through a wall separating the chambers. A low temperature differential between the two elements is provided by extending one of the leads from the other one chamber to a position directly underlying and in intimate contact with the bottom surface of the processing element in the other chamber. Additionally, the bottom member is of a high thermal conductivity material and extends along the bottom of the housing member to beneath the other chamber.

Pressure sensor and method of fabrication thereof

A pressure sensor includes a pressure sensitive element and associated integrated circuitry on a common silicon chip. Fusible links in a conditioning network of the integrated circuit are opened by electrical pulses applied to pinouts that are accessible for probing in a trough in the support housing that is exposed during the testing and adjusting phase, but is sealed off by the cover in the final assembly so that the pinouts are no longer accessible.

Growing community of inventors

Kokomo, IN, United States of America

Michael J Luettgen