Honeywell G.m.b.h.

Alliant Techsystems Inc.

Orbital Atk, Inc.

Michael J Gawronski

John R Lamberg

Christopher Coy Fuller

John J Geddes

Rebecca A Hart

Steven L Palmquist

Composite material, devices incorporating the composite material and methods of forming the composite material are provided. The composite material includes interstitial material that has at least one of a select relative permittivity property value and a select relative permeability property value. The composite material further includes inclusion material within the interstitial material. The inclusion material has at least one of a select relative permeability property value and a select relative permittivity property value. The select relative permeability and permittivity property values of the interstitial and the inclusion materials are selected so that the effective intrinsic impedance of the interstitial material and the inclusion material match the intrinsic impedance of air. Devices made from the composite include metamaterial and/or metamaterial-inspired (e.g., near-field LC-type parasitic) substrates and/or lenses, front-end protection, stealth absorbers, filters and mixers. Beyond the intrinsic, applications include miniature antennas and antenna arrays, directed energy weapons, EMI filters, RF and optical circuit components, among others.

Composites for antennas and other applications

Composite material, devices incorporating the composite material and methods of forming the composite material are provided. The composite material includes interstitial material that has at least one of a select relative permittivity property value and a select relative permeability property value. The composite material further includes inclusion material within the interstitial material. The inclusion material has at least one of a select relative permeability property value and a select relative permittivity property value. The select relative permeability and permittivity property values of the interstitial and the inclusion materials are selected so that the effective intrinsic impedance of the interstitial and the inclusion material match the intrinsic impedance of air. Devices made from the composite include metamaterial and/or metamaterial-inspired (e.g. near-field LC-type parasitic) substrates and/or lenses, front-end protection, stealth absorbers, filters and mixers. Beyond the intrinsic, applications include miniature antenna and antenna arrays, directed energy weapons, EMI filters, RF and optical circuit components, among others.

A radar system includes at least one transmit array comprising a plurality of metamaterial elements. The radar system further includes at least one near-field stimulator for inputting electromagnetic signal to the transmit array so that a sub-wavelength target is illuminated with an electromagnetic wave.

Resolution radar using metamaterials

An antenna array includes at least one transmit array comprising a plurality of metamaterial elements. The antenna array further includes at least one near-field stimulator for inputting electromagnetic signal to the transmit array so that a sub-wavelength target is illuminated with an electromagnetic wave.

Resolution antenna array using metamaterials

A side-launch transition for efficiently joining a coaxial transmission line or coaxial connector to a microstrip transmission line for operation at millimeter wave frequencies. The microstrip transmission line comprises a conductive microstrip pattern on one side of a dielectric substrate and a ground plane on the other. The conductive microstrip pattern includes a rectangular terminal pad area of a predetermined length designed to be approximately equal to the wavelength of the signal being transmitted. This pad area is integrally joined to the microstrip line. A circular iris or aperture, is formed through the ground plane and is in a centered alignment with the terminal pad on the opposite side of the substrate. A small hole extends through the center of the iris and penetrates the substrate as well as the conductive pad area. The outer shield conductor of the coaxial transmission line or the coaxial connector and the dielectric material insulating it from its center conductor are stripped back to expose a predetermined length of center conductor which is then fitted through the small hole from the ground plane side of the substrate and soldered to the conductive pad. The outer shield is likewise soldered or otherwise conductively bonded to the ground plane in the vicinity of the iris aperture.

Millimeter wave microstrip to coaxial line side-launch transition

A microwave and millimeter wave hybrid or monolithic microstrip test probe assembly provides a noninvasive radio frequency test point in a microstrip circuit. The probe assembly comprises a microstrip coupler. (12) adjacent a microstrip line (10) in the circuit for sampling a small amount of microwave energy propagating along said microstrip line. A stripline circuit (20, 22 and 24) is connected to the microstrip coupler. The stripline circuit includes a pad area (24) and a probe (26) moveable to overlay the pad area. The probe forms a ground plane with respect to the pad area, and a coaxial line (34) has an outer conductor connected to the probe and an inner conductor projecting through a hole in the probe. The probe assembly provides an RF test point within a microstrip circuit which allows an accurate, calibrated and repeatable means of sampling a microstrip signal while not affecting the normal performance of the hybrid or monolithic circuit. The probe (26) is removable and is introduced into the circuit for testing purposes.

MMW microstrip coupler having movable test probe

A microstrip attenuator comprising a block of lossy material which is preferably impregnated with ferrite particles and having a groove of a predetermined height and width dimension formed in the bottom surface thereof defining a tunnel and positionable upon a microstrip transmission line assembly, such that the microstrip element of the assembly passes through the tunnel, but is in non-contact relation with respect to the surface-mounted microstrip element. The degree of attenuation afforded by the attenuator is primarily a function of the aforementioned length and height dimension of the tunnel formed in the block of lossy material.

Growing community of inventors

Minneapolis, MN, United States of America

Michael J Gawronski