Onetta, Inc.

Asml Netherlands B.v.

Brion Technologies, Inc.

Michael J Gassner

Jun Ye

Moshe E Preil

John Pease

Yu Long Cao

Stefan Hunsche

James Norman Wiley

Shauh-Teh Juang

Lechuan Xue

One embodiment of a method for detecting, sampling, analyzing, and correcting hot spots in an integrated circuit design allows the identification of the weakest patterns within each design layer, the accurate determination of the impact of process drifts upon the patterning performance of the real mask in a real scanner, and the optimum process correction, process monitoring, and RET improvements to optimize integrated circuit device performance and yield. The combination of high speed simulation coupled with massive data collection capability on actual aerial images and/or resist images at the specific patterns of interest provides a complete methodology for optimum RET implementation and process monitoring.

Method for detecting, sampling, analyzing, and correcting marginal patterns in integrated circuit manufacturing

A method of using an in-situ aerial image sensor array is disclosed to separate and remove the focal plane variations caused by the image sensor array non-flatness and/or by the exposure tool by collecting sensor image data at various nominal focal planes and by determining best focus at each sampling location by analysis of the through-focus data. In various embodiments, the method provides accurate image data at best focus anywhere in the exposure field, image data covering an exposure-dose based process window area, and a map of effective focal plane distortions. The focus map can be separated into contributions from the exposure tool and contributions due to topography of the image sensor array by suitable calibration or self-calibration procedures. The basic method enables a wide range of applications, including for example qualification testing, process monitoring, and process control by deriving optimum process corrections from analysis of the image sensor data.

System and method for measuring and analyzing lithographic parameters and determining optimal process corrections

There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of, and system for autonomously monitoring fabrication equipment, for example, integrated circuit fabrication equipment. In one embodiment of this aspect of the invention, the present invention is an autonomous monitoring device including one or more event sensors (for example, acceleration, motion, velocity and/or inertial sensing device(s)) to detect a predetermined event of or by the fabrication equipment (for example, an event that is indicative of the onset, commencement, initiation and/or launch of fabrication process or sub-processes of or by the fabrication equipment). In response thereto, one or more process parameter sensors sample, sense, detect, characterize, analyze and/or inspect one or more parameters of the process in real time (i.e., during the fabrication process).

Method and apparatus for synchronizing data acquisition of a monitored IC fabrication process

Optical amplifiers and other optical network equipment are provided for use in fiber-optic communications networks. The equipment may include dynamic spectral filters and optical channel monitors. Control units may be used to control the operation of the equipment. Components in the equipment may be interconnected using communications paths. The communications paths may include paths such as synchronous and asynchronous paths, point-to-point and multidrop paths, RS-232 paths, two-wire interface bus paths, parallel bus paths, and synchronous serial interface paths. The communications paths may be used to support an extensible equipment architecture that allows equipment features to be changed and added.

Optical network equipment with control and data paths

Optical detector components in a fiber-optic communication system are temperature stabilized. The optical detector components may be part of an optical amplifier, a receiver, or other optical device. A temperature-controlled housing may be used to stabilize the temperature of a photodiode and/or a transimpedance amplifier of the optical detector. The housing may additionally be used to stabilize the temperature of the coils of a fiber optic amplifier and possibly other components.

Temperature control and monitoring of optical detector components in an optical communication system

An optical amplifier control system provides real-time control of an optical amplifier in response to an analog signal having a large dynamic range. The optical amplifier control system uses a non-linear analog-to-digital converter, such as a logarithmic-scale analog-to-digital converter to achieve low relative quantization error. The amplifier control system may also use multiple analog-to-digital converters.

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San Jose, CA, United States of America

Michael J Gassner