International Business Machines Corporation

International Business Corporation

Michael J Fisher

David Clifford Long

James A Busby

Thomas Weiss

William Santiago-Fernandez

John Richard Dangler

William Louis Brodsky

Silvio Dragone

Arthur J Higby

Michael T Peets

Edward N Cohen

Robert L Weiss

Zachary Thomas Dreiss

James Edward Tersigni

Joseph P Corrado

Matthew Stephen Doyle

Michael A Gaynes

Russell Alan Budd

Roger Scott Krabbenhoft

Alexandra Echegaray

Kathleen Ann Fadden

Kenneth Parker Rodbell

Stefano Sergio Oggioni

Budy D Notohardjono

Gary Franklin Goth

Ethan E Cruz

Donald Merte

Michel Turgeon

Robert H Cadwallader

Thomas Clarke Morrison

Sylvain Tetreault

Tristen Gaudette

Gerald Keith Bartley

Darryl John Becker

Mark Kenneth Hoffmeyer

Mark James Jeanson

Wiren Dale Becker

Shawn Canfield

Ryan Elsasser

Mark A Brandon

Wade H White

William Santiago Fernandez

Philipp K Buchling Rego

Kenneth Y Chan

Rorie Paul Reyes

Udo Jourdan

Daniel James Buschel

Gilles G Labbe

Dennis Denizard

Gerald P Monaco

A tamper detection system may include organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated away to form an incision in the organic material. A portion of the tamper detection circuit obstructs a fragment of the ablation path. The tamper detection circuit remains intact. The incision enables a gas flow between a first side of the organic material and a second side of the organic material.

Secure ventilation through protective flexible sensors

An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

Leakage characterization for electronic circuit temperature monitoring

An electronic system can include an electronic module and a trace circuit that provides a perimeter that encloses the electronic module. A sensing circuit within the electronic system can be configured to detect a discontinuity in the perimeter. In response to detecting the discontinuity in the perimeter, the sensing circuit can initiate, from a response device, a response signal.

Leakage characterization and management for electronic circuit enhancement

A uniform thickness flex circuit is taught that uses more than one dielectric layer. A first dielectric layer is more flexible and capable of reliably bending at a radius of curvature at which a second dielectric layer cannot be reliably bent. The second dielectric layer has at least one more desirable electrical characteristic than the first dielectric area, for example leakage. Use of the uniform thickness flex circuit to protect sensitive material in an electronic enclosure is also described.

Dielectric material change to optimize electrical and mechanical properties of flex circuit

Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. The at least one interconnect element is undetectable by x-ray, and the conductive lines are detectable by x-ray. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.

Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout

Tamper-respondent assemblies and fabrication methods are provided which utilize liquid crystal polymer layers in solid form. The tamper-respondent assemblies include a circuit board, and an enclosure assembly mounted to the circuit board to enclose one or more electronic components coupled to the circuit board within a secure volume. The assembly includes a tamper-respondent sensor that is a three-dimensional multilayer sensor structure, which includes multiple liquid crystal polymer layers, and at least one tamper-detect circuit. The at least one tamper-detect circuit includes one or more circuit lines in a tamper-detect pattern disposed on at least one liquid crystal polymer layer of the multiple liquid crystal polymer layers. Further, a monitor circuit is provided disposed within the secure volume to monitor the at least one tamper-detect circuit of the tamper-respondent sensor for a tamper event.

Tamper-respondent sensors with liquid crystal polymer layers

Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure-to-circuit board protection. The tamper-respondent assemblies include a circuit board, and an enclosure mounted to the circuit board along an enclosure-to-board interface. The enclosure facilitates enclosing at least one electronic component coupled to the circuit board within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and includes one or more tamper-detect circuits including at least one conductive trace disposed, at least in part, within the enclosure-to-board interface. The conductive trace(s) includes stress rise regions to facilitate tamper-detection at the enclosure-to-board interface. An adhesive is provided to secure the enclosure to the circuit board. The adhesive contacts, at least in part, the conductive trace(s) of the tamper-detect circuit(s) at the enclosure-to-board interface, including at the stress rise regions of the conductive trace(s).

Enclosure-to-board interface with tamper-detect circuit(s)

Embodiments of the invention are directed to a method for creating a secure volume. A method includes adhering a flexible circuit to a surface of an enclosure. A first portion of the flexible circuit extends outward from the perimeter of the enclosure. A second portion of the flexible circuit is adhered to the center portion of the enclosure. Pressure is applied to the flexible circuit to ensure that it is affixed to the enclosure. The flexible circuit and the enclosure are then subjected to an annealing temperature. The duration and temperature are based on the adhesive and flexible circuit material. The extended portion of the flexible circuit is coated with an adhesive and folded over the second portion of the flexible circuit. Pressure is applied to the folded flexible circuit. The folded flexible circuit is then subjected to an annealing temperature.

Creating a secure volume

The present invention relates to a method to fabricate a tamper respondent assembly. The tamper respondent assembly includes an electronic component and an enclosure fully enclosing the electronic component. The method includes printing, by a 3-dimensional printer, a printed circuit board that forms a bottom part of the enclosure and includes a first set of embedded detection lines for detecting tampering events and signal lines for transferring signals between the electronic component and an external device. The electronic component is assembled on the printed circuit board, and a cover part of the enclosure is printed on the printed circuit board. The cover part includes a second set of embedded detection lines. Sensing circuitry can be provided for sensing the conductance of the first set of embedded detection lines and the second set of embedded detection lines to detect tampering events.

Enclosure with tamper respondent sensor

A process for deforming a flex circuit using a fixture assembly including a base plate having a recess, a wrinkle reducer plate, a stiffening block and a punch. The process including heating the fixture assembly; applying a force to the punch deforming the flex circuit into the recess in the base plate; holding the punch in contact with the flex circuit while heating the fixture assembly; cooling the fixture assembly with the punch in contact with the flex circuit; subsequent to cooling the fixture assembly, removing the force of the punch; and removing the flex circuit from the fixture assembly. The flex circuit having a recessed portion resulting from deforming the flex circuit into the recess in the base plate and a flat portion surrounding the recessed portion.

3-D flex circuit forming

Tamper-respondent assemblies are provided which include an enclosure with an edge surface, and a tamper-respondent sensor. The tamper-respondent sensor covers, at least in part, the edge surface and an inner surface of the enclosure. The sensor includes at least one tamper-detect circuit. The tamper-detect circuit(s) includes a conductive trace(s) in a tamper-detect pattern. The tamper-respondent sensor includes exposed regions and unexposed regions of the conductive trace(s) at the edge surface of the enclosure to facilitate an adhesive directly contacting the at least one conductive trace in the exposed regions.

Tamper detection at enclosure-to-board interface

Methods of fabricating tamper-respondent assemblies with bond protection are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s).

Tamper-respondent assemblies with bond protection

A fixture assembly for deforming a flex circuit that includes: a base plate having a recess; a wrinkle reducer plate having a first cut-out portion aligned with the recess; a stiffening block having a second cut-out portion aligned with the recess and the first cut-out portion; and a punch to slideably engage with the recess, the first cut-out portion and the second cut-out portion; wherein, in operation, a flex circuit is placed between the base plate and wrinkle reducer plate and the punch extends through the first cut-out portion and the second cut-out portion to engage the flex circuit and deform the flex circuit into the recess so that the flex circuit has a formed section in the shape of the recess and a flat section clamped by the wrinkle reducer plate and the base plate.

Tamper-respondent assemblies are provided which include an enclosure assembly mounted to a circuit board and enclosing an electronic component(s) within a secure volume. The enclosure assembly includes an enclosure with an edge surface coupled to the circuit board, and a tamper-respondent sensor. The tamper-respondent sensor covers the edge surface and an inner surface of the enclosure. The sensor includes multiple layers, and at least one tamper-detect circuit. The tamper-detect circuit(s) includes a conductive trace(s) in a tamper-detect pattern covered, at least in part, by at least one layer of the multiple layers. The at least one layer is partially removed to provide exposed regions and unexposed regions of the conductive trace(s) at the edge surface of the enclosure. The conductive trace(s) is contacted where exposed by an adhesive securing the sensor to the circuit board. A monitor circuit monitors the tamper-detect circuit(s) for a tamper event.

Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.

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Poughkeepsie, NY, United States of America

Michael J Fisher