International Business Machines Corporation

Michael J Fedor

David Lee Darrington

Adam C Emerich

Raymond K Shokes

Methods, systems, and products are provided for monitoring the temperature of a high powered computing component. The high powered computing component has a thermal sensor and the high powered computing component in thermal communication with a liquid cooled heatsink. Embodiments include determining, by a thermal monitoring module, a temperature of the thermal sensor; determining, by the thermal monitoring module, a temperature of the heatsink; determining, by the thermal monitoring module, a power delivered to the high powered computing component; and calculating, by the thermal monitoring module, a thermal value in dependence upon the temperature of the thermal sensor, the temperature of the heatsink, and the power delivered to the high powered computing component.

Calculating a thermal value to control the flow of liquid through the liquid cooled heatsink which is in thermal communication with the high powered computing component

Method to control the temperature of a high powered computing component through a liquid cooled heatsink responsive to an increase in the thermal value

Growing community of inventors

Rochester, MN, United States of America

Michael J Fedor