International Business Machines Corporation

Michael J Emmett

Ronald L Hering

Eric B Hultmark

Howard D Hutchinson

Hilton T Toy

Kamal Kumar Sikka

David L Edwards

Sushumna Iruvanti

Raed A Sherif

A book-like fixture and method for assembly of a plurality of multi-layered ceramic packages including a substrate and a cap. The fixture has a baseplate, a removable tray, an alignment plate for precisely aligning the caps with the substrates, a compression plate, and a plurality of compression devices designed to uniformly distribute compressive force on the plurality of packages. The fixture is preferably adapted for use of removable trays conforming to the Joint Electronics Design Engineering Council Tray Standard. The compression devices preferably have a spring, preferably a detachable leaf spring, and a compression plate placed over each cap. The structure of the fixture allows replacement of the springs and other modifications to allow assembly of multi-layered ceramic packages of differing dimensions. The structure of the fixture also allows stacking one on top of another.

Method for assembling a multi-layered ceramic package

A method and apparatus for electronic chip assembly maintains a thin gap spacing between the chip and the lid or heat sink and provides for the electronic chip to operate at a relatively cool temperature. The thermal performance is enhanced by a thermal interface material provided in the thin gap and maintained at a minimal thickness as a result of the structure and assembly process. A thin thermal interface material layer may be achieved with a compression step to compress the thermal interface material before the sealant is cured. In addition, a vent hole is provided in the assembly to prevent pressure build-up inside the module during sealant cure. As the sealant is cured, the gap spacing is maintained, further compression of the thermal interface material is not required, and seal defects are prevented.

Method for controlling thermal interface gap distance

Fixture for multi-layered ceramic package assembly

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Poughkeepsie, NY, United States of America

Michael J Emmett