International Business Machines Corporation

Other

Vette Corporation

Darpa

Michael J Ellsworth, Jr

Robert E Simons

Richard C Chu

Levi A Campbell

Madhusudan K Iyengar

Roger R Schmidt

Milnes P David

Eric James McKeever

Prabjit Singh

Amilcar R Arvelo

Dustin W Demetriou

Edward Joseph Seminaro

Evan G Colgan

Alan Frederic Benner

Randall G Kemink

Thong N Nguyen

Mark A Brandon

Egidio E Marotta

Thomas J Brunschwiler

Frank Louis Pompeo

Gerd Schlottig

Jing Zhang

Donald W Porter

Richard P Snider

Arvind Kumar Sinha

John Lee Colbert

Lewis Sigmund Goldmann

Randy J Zoodsma

Michael J Domitrovits

Jeffrey Thomas Coffin

David T Vader

Tan D Doan

Ravi Kumar Arimilli

Casimer M DeCusatis

Jason T Wertz

Dylan J Boday

John S Werner

Paul Alfred Lauro

Arkadiy O Tsfasman

Da-Yuan Shih

Mark Kenneth Hoffmeyer

Hilton T Toy

Jason Aaron Matteson

Pasquale A Catalano

Vinod Kamath

David L Edwards

Jeffrey Allen Zitz

Sushumna Iruvanti

Bruce Kenneth Furman

Gary Franklin Goth

Phillip Duane Isaacs

Andrew Gerald Crimmins

Francis R Krug, Jr

Raed A Sherif

William Edward Sablinski

Christopher Michael Marroquin

Jason R Eagle

Mark G Courtney

Michael Lynn Zumbrunnen

Steve Ostrander

Edward F Furey

Madhana Sunder

Enrico A Romano

Dereje Agonafer

Ingmar G Meijer

Werner Escher

Armando S Cammarano

Stephen S Drofitz, Jr

Joyce E Molinelli Acocella

Daren Simmons

Michael G Betro

Daniel E Zambrano

Keith E Fogel

Michael Rizzolo

Budy D Notohardjono

John G Torok

Robert K Mullady

James A Busby

Martin Joseph Crippen

David P Graybill

Stephan Paredes

William F Beausoleil

Edmund D Blackshear

Howard V Mahaney, Jr

Bret W Lehman

Takeshi Tsukamoto

Maurice Francis Holahan

Jay A Bunt

Hongqing Zhang

William Frederick Shutler

Sal M Rosato

David J Lewison

Vidhya Shankar Venkatesan

Norton J Tomassetti

Paul Samaniego

Paul A Zucco

Richard Chao-Fan Chu

John V Palmer

Brian Werneke

Martin Witzig

An apparatus used for analysis of a fluid-based system that includes a main chamber consisting of an optically transparent high strength material that ensures transmission of infrared and ultraviolet wavelengths and is capable of withstanding high pressures. The apparatus also includes first and second fluid tight endcaps attached to first and second ends of the main chamber, wherein the first endcap permits entry of a fluid into the main chamber and the second endcap permits the fluid to exit the main chamber. The apparatus further includes a fixed filter guide rail located inside the main chamber and attached to one of the end caps, and a filter located inside the main chamber and configured to removably attach to the fixed filter guide rail, wherein the filter is capable of capturing residue or contaminants in the fluid.

Portable inspection, collection, and delivery apparatus for fluid-based systems

Apparatuses and methods of fabrication are provided which include a coolant-cooled heat sink through which coolant passes to facilitate cooling the coolant-cooled heat sink, and an ultra-violet (UV) light assembly associated with the coolant-cooled heat sink for directing UV light towards an interior surface of the coolant-cooled heat sink across which the coolant passes. The UV light inhibits bacterial growth at the interior surface of the coolant-cooled heat sink.

Coolant-cooled heat sink(s) with associated ultra-violet light assembly

A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

Fixture facilitating heat sink fabrication

A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.

Customized module lid

An air-to-coolant heat exchanger for an electronics rack is provided, which includes first and second tube segments, one or more connector segments, and a plurality of thermally conductive fins attached to the tube segments. The first tube segment includes a first inner tube positioned within a first outer tube, defining a first inner coolant-carrying channel and first outer coolant-carrying channel, and the second tube segment has a second inner tube positioned within a second outer tube, defining a second inner coolant-carrying channel and second outer coolant-carrying channel. The connector segment(s) couples in fluid communication at least one of the first and second inner coolant-carrying channels, or the first and second outer coolant-carrying channels. The heat exchanger is coupled to separately receive a first coolant and a second coolant, with the first coolant passing through the inner channels, and the second coolant through the outer channels.

Multi-coolant heat exchanger for an electronics rack

Automated managing of a data center installation is provided. The managing includes evaluating, at least in part by image processing analysis, a captured image of at least a portion of the data center installation to identify a component-related deficiency within the data center installation. One or more measurements within a data center are used to determine an energy penalty due to the identified component-related deficiency within the data center installation, and an action to correct the component-related deficiency within the data center installation is initiated based on the energy penalty exceeding a predefined threshold.

Automated managing of a data center installation

Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

Effectiveness-weighted control of cooling system components

Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting.

Coupling assemblies for connecting fluid-carrying components

Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.

Composite heat sink structures

A method of providing a cooling apparatus for cooling a heat-dissipating component(s) of an electronics enclosure includes: providing a thermal conductor to couple to the heat-dissipating component(s), the thermal conductor including a first conductor portion coupled to the heat-dissipating component, and a second conductor portion to position along an air inlet side of the electronics enclosure, so that in operation, the first conductor portion transfers heat from the component(s) to the second conductor portion; coupling at least one air-cooled heat sink to the second conductor portion to facilitate transfer of heat to airflow ingressing into the enclosure; providing at least one thermoelectric device coupled to the first or second conductor portion to facilitate providing active auxiliary cooling to the thermal conductor; and providing a controller to control operation of the thermoelectric device(s) and to selectively switch operation of the cooling apparatus between active and passive cooling modes.

Thermoelectric-enhanced, inlet air-cooled thermal conductors

A pump is provided which includes a rotating element, and a volute housing having a fluid inlet and a fluid outlet. In operational state, the rotating element rotates, drawing fluid through the fluid inlet of the volute housing and expelling the fluid at a higher pressure through the fluid outlet. Further, the pump includes a bypass mechanism integrated, at least in part, within the volute housing and exposing in nonoperational state of the pump, a bypass path through, at least in part, the volute housing that allows the fluid to pass from the fluid inlet to the fluid outlet of the pump.

Pump with integrated bypass mechanism

Embodiments of the invention include an apparatus, a computer-implemented method, and a computer program product for branding a quick response code onto a surface. Aspects of the invention include a branding device having a plurality of thermoelectric devices on a substrate. Each of the thermoelectric devices is arranged on the substrate as a single bit in a quick response pattern. Each of the thermoelectric devices includes an n-type thermoelectric element electrically coupled to a p-type thermoelectric element. The thermoelectric elements can be individually heated or cooled using the Peltier effect.

Dynamic thermoelectric quick response code branding

Growing community of inventors

Lagrangeville, NY, United States of America

Michael J Ellsworth, Jr