Silicon Light Machines Corporation

Other

Invensense, Inc.

Nextinput, Inc.

Cypress Semiconductor Corporation

Michael J Dueweke

Dinesh Maheshwari

Martin Lim

Dan Benjamin

Andrew J Walker

Joseph Seeger

Jahja I Trisnadi

Omar Sze Leung

David T Amm

James A Hunter

Alexander P Payne

Matthew Julian Thompson

Julius Minglin Tsai

Ryan Matthew Diestelhorst

Ilya Gurin

Marc D Hartranft

Douglas Webb

Wilhelmus Adrianus De Groot

Ali Foughi

Gregory Beach

Brent D Lunceford

Allan Liu

Christopher Gudernan

Described herein is a method and system for testing a force or strain sensor in a continuous fashion. The method employs a sensor, a test fixture, a load cell, a mechanical actuator and tester hardware and software to simultaneously record signal outputs from the sensor and load cell as functions of time. The method provides time synchronization events for recording data streams between, for example, a linear ramp of the force on, or displacement of, the sensor and for extracting performance characteristics from the data in post-test processing.

Systems and methods for continuous mode force testing

In one embodiment, a ruggedized wafer level microelectromechanical ('MEMS') force sensor includes a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor ('CMOS') circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.

Integrated digital force sensors and related methods of manufacture

A self-tuning impedance-matching microelectromechanical (MEMS) circuit, methods for making and using the same, and circuits including the same are disclosed. The MEMS circuit includes a tunable reactance element connected to a first mechanical spring, a separate tunable or fixed reactance element, and an AC signal source configured to provide an AC signal to the tunable reactance element(s). The reactance elements comprise a capacitor and an inductor. The AC signal source creates an electromagnetically energy favorable state for the tunable reactance element(s) at resonance with the AC signal. The method of making generally includes forming a first MEMS structure and a second mechanical or MEMS structure in/on a mechanical layer above an insulating substrate, and coating the first and second structures with a conductor to form a first tunable reactance element and a second tunable or fixed reactance element, as in the MEMS circuit.

Self-tuning microelectromechanical impedance matching circuits and methods of fabrication

A tunable reactance device and methods of manufacturing and using the same are disclosed. The tunable reactance device includes a substrate, a microelectromechanical (MEM) structure supported on the substrate and comprising a conductive material, and a driver configured to move the MEM structure with respect to the substrate upon application of an electrostatic force to the driver. A gap between the MEM structure and the substrate is maintained when the driver moves the MEM structure. The tunable reactance device has (i) a first reactance and a first electromagnetic field topology when the electrostatic force is applied to the driver and (ii) a different reactance and a different electromagnetic field topology when a different electrostatic force is applied to the driver.

Tunable reactance devices, and methods of making and using the same

A method and system for changing a pressure within at least one enclosure in a MEMS device are disclosed. In a first aspect, the method comprises applying a laser through one of the at least two substrates onto a material which changes the pressure within at least one enclosure when exposed to the laser, wherein the at least one enclosure is formed by the at least two substrates. In a second aspect, the system comprises a MEMS device that includes a first substrate, a second substrate bonded to the first substrate, wherein at least one enclosure is located between the first and the second substrates, a metal layer within one of the first substrate and the second substrate, and a material vertically oriented over the metal layer, wherein when the material is heated the material changes a pressure within the at least one enclosure.

Cavity pressure modification using local heating with a laser

A MEMS sensor is disclosed. The MEMS sensor includes a MEMS structure and a substrate coupled to the MEMS structure. The substrate includes a layer of metal and a layer of dielectric material. The MEMS structure moves in response to an excitation. A first over-travel stop is formed on the substrate at a first distance from the MEMS structure. A second over-travel stop on the substrate at a second distance from the MEMS structure. At least one electrode on the substrate at a third distance from the MEMS structure. The first, second and third distances are all different.

MEMS sensor including an over-travel stop and method of manufacture

A circuit and method are provided for preventing snapdown in a voltage controlled Micro-Electromechanical System device having a movable actuator with an actuator electrode coupled to a first potential, the actuator suspended over a cavity electrode coupled to a second potential. Generally, the circuit includes an in-circuit conductive path between the actuator electrode and the cavity electrode, the conductive path configured to transfer charge therebetween when a voltage between the first and second potential exceeds a predetermined threshold voltage. In one embodiment the conductive path comprises an ESD clamp coupled between the actuator electrode and the cavity electrode. Other embodiments are also disclosed.

Circuit and method for snapdown prevention in voltage controlled MEMS devices

One embodiment relates to a method of independently controlling amplitude and phase modulation by a spatial light modulator. Light is illuminated onto upper layer deflectable planar areas and lower layer deflectable planar areas over a substrate of the spatial light modulator. First active circuitry on the substrate is used to provide amplitude modulation by controlling a relative displacement between upper layer deflectable planar areas and adjacent lower layer deflectable planar areas. Second active circuitry on the substrate is used to provide phase modulation by controlling a displacement between the (upper and lower layer) deflectable planar areas and the substrate. Other embodiments and features are also disclosed.

Multi-layer spatial light modulator for amplitude and phase control

The present disclosure describes an optical displacement sensor having a dense multi-axis array of photosensitive elements. Generally, the sensor includes a two dimensional array of multiple photosensitive elements. In one embodiment, the array includes multiple linear arrays of photosensitive elements arranged along three or more axes in a space-filling, close-packed multi-axis array. The photosensitive elements are connected to each other in such a way that motion is determinable along each of the axes by measuring differential photocurrents between photosensitive elements along each of the axes. The inventive architecture advantageously increases signal redundancy, and reduces signal drop-out or low signals due to random fluctuations in the incident or absorbed light or in the signals from the photosensitive elements.

Dense multi-axis array for motion sensing

In one embodiment disclosed, a light modulator can be configured to have a substantially flat optically active modulator element portion while deflected. The modulator can include a plurality of modulator elements arranged substantially in parallel, with each modulator element including an optically active portion and a support portion on either side of the optically active portion. Further, the optically active portion can have a narrower width than the support portion. In another embodiment disclosed, a movable membrane for light modulation includes a substantially circular optically active portion and a released membrane portion surrounding the circular optically active portion. The substantially circular optically active portion can also include a plurality of gaps configured to expose a lower surface. Further, the substantially circular optically active portion can be essentially flat while in a deflected state.

Diffractive light modulator

A modulator for modulating an incident beam of light. The modulator includes a plurality of elements, each element including a first end, a second end, a first non-linear side, a second non-linear side, and a light reflective planar surface. The light reflective planar surfaces of the plurality of elements lie in one or more parallel planes. The elements are preferably arranged parallel to each other. The modulator also includes a support structure to maintain a position of each element relative to each other and to enable movement of selective ones of the plurality of elements in a direction normal to the one or more parallel planes of the plurality of elements. The plurality of elements are preferably moved between a first modulator configuration wherein the plurality of elements act to reflect the incident beam of light as a plane mirror, and a second modulator configuration wherein the plurality of elements act to diffract the incident beam of light. The non-linear sides substantially reduce the polarization dependent losses for diffraction from the plurality of elements.

PDL mitigation structure for diffractive MEMS and gratings

A modulator for modulating an incident beam of light. The modulator includes a plurality of elements, each element including a first end, a second end, a first linear side, a second linear side, and a continuous or non-continuous light reflective planar surface plurality of elements are arranged parallel to each other and further wherein the light reflective planar surface of each of the plurality of elements includes a first non-linear side and a second non-linear side. The modulator also includes a support structure coupled to each end of the plurality of elements to enable movement between a first modulator configuration wherein the plurality of elements act to reflect the incident beam of light as a plane mirror, and a second modulator configuration wherein the plurality of elements act to diffract the incident beam of light.

Patterned diffractive light modulator ribbon for PDL reduction

Energy is applied to a portion of a conducting body. In preferred embodiments, relative motion between the conducting body and the energy source is created such that the energy source moves along a thermal diffusion front, thereby enhancing the thermal diffusion front in the direction of the relative movement. The energy is preferably applied in a portion of the conducting body with higher thermal mass and the enhanced thermal diffusion front is directed toward a portion with lower thermal mass. The lower thermal mass portion expands, thereby creating fissures in surrounding material, then melts, flows through the fissures and contacts another conductor, thereby forming a conductive link.

Method and structure for forming metallic interconnections using directed thermal diffusion

A method and device for forming metal capacitor and integrated coaxial lines using energy transfer so as to form conductive links among conductors. Conductors are embedded within nonconductive layers, such that the conductors form a matrix of at least three levels. A source of energy is directed at the layers, such that at least one conductor is wholly shielded by at least one other conductor, and conductive paths form so that a conductor becomes shielded by the paths. Particular conductive path formation is encouraged by use of: differing surface areas of conductors; diffusion barriers to increase relative energy absorption; varied relative distances among conductors; some conductors having a lower melting point than other conductors; directing the energy to conductors in a particular order; or combinations thereof. In one variation, links among differing layers are formed using more than one energy source or sequentially generated and directed pulses of energy.

Growing community of inventors

Santa Clara, CA, United States of America

Michael J Dueweke