Machine Technology, Inc.

Michael J Devico

Gary Hillman

An apparatus and method for retarding splashback of liquids collected from a rotating workpiece is disclosed. In accordance with the apparatus, there is provided a work station upon which a workpiece, such as a semiconductor wafer, is positioned, a collecting means for collecting liquids discharged from the workpiece by rotation of the work station and a means for rotating the collecting means. Also in accordance with the present invention, the collecting means may be rotated separately from the work station but in the same direction as the work station. In accordance with the method, there is provided applying liquids to the workpiece, rotating work station with the workpiece positioned on it and rotating a collecting means in the same direction as the work station. Also in accordance with the invention, the apparatus may be combined with apparatus for a segregated drainage of first and second liquids such that splashback during collection of these liquids will be retarded.

Splash retarder

An arrangement is provided for performing a plurality of processes on workpieces, such as silicon wafers, while they remain at a single processing station. The processing operations include scrubbing, coating, developing, and/or baking the wafer without removing it from a work support at the work station. The apparatus includes a transferring device for automatically transferring the wafer from a cassette to a work support. In addition, positioned about the centrally-located work support is a scrubbing device for scrubbing the wafer and a liquid dispensing device for dispensing liquid on the wafer. Each is movable into and out of position over the work support. In addition, the work support is surrounded by a microwave chamber for baking the wafer while it remains on the work support.

Method and apparatus for processing workpieces

Apparatus is provided for transferring a selected one of a plurality of workpieces, such as silicon wafers or masks, from within a cassette containing the workpieces to a processing station for scrubbing, etching, etc. The apparatus includes a wafer-supporting arm which is movable between a retracted position within the cassette and a scrubbing station for moving the selected one of the silicon wafers from its position within the cassette to the scrubbing station and for returning the selected wafer from the scrubbing station to the cassette. A selection device then operates to move the cassette downwardly so that the next silicon wafer to be cleaned is in position to be picked up by the wafer-supporting arm when it is next moved between its retracted position and the scrubbing station.

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Madison, NJ, United States of America

Michael J Devico