Santa Barbara Research Center

Michael J Dahlin

Jose A Santana

An optical device assembly includes a planar optical filter and a planar sensor having an optically active area. The optical filter and the sensor are joined together with a gap therebetween by a standoff structure extending between the optical filter and the sensor. The standoff structure is positioned at a location outside of the optically active area of the planar sensor. The standoff structure includes a standoff element, a first bonding element between the standoff and the filter, and a second bonding element between the standoff and the sensor. The two bonding elements each preferably comprise a cold-weldable indium bump. If the standoff structure, the filter, or the sensor is made of a material to which indium does not readily cold weld, a bonding pad of a material such as titanium/nickel can be inserted to facilitate the cold welding.

Optical device assembly and its preparation using metallic bump bonding

An optical device assembly includes a planar optical filter and a planar sensor having an optically active area. The optical filter and the sensor are joined together with a gap therebetween by a metallic bump extending between the optical filter and the sensor. The metallic bump, which is preferably indium, is positioned at a location outside of the optically active area of the planar sensor. The metallic bump is preferably formed by vapor depositing an indium subbump on the optical filter and another indium subbump on the planar sensor, in each case outside of their optically active areas, and thereafter pressing the two subbumps together to complete the bonding.

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Santa Barbara, CA, United States of America

Michael J Dahlin