Lsi Logic Corporation

Lsi Corporation

Tempronics, Inc.

Michael J Berman

Steven E Reder

George Edward Bailey

Rennie G Barber

Jayashree Kalpathy-Cramer

Tarek Makansi

John Latimer Franklin

Mark Nelsen Evers

Steven Wood

Matthew R Trattles

Zachary A Prather

Robert D Broyles

Chok J Chia

Aftab A Ahmad

Qwai Hoong Low

Derryl D Allman

Bruce Joseph Whitefield

Hemanshu D Bhatt

Ramaswamy Ranganathan

Eric J Kirchner

Jan Fure

Thomas Frederick Bibby, Jr

Steve Wood

Scott Gould

Karey L Holland

Steve Thomson

Joseph B Barsky

A thermoelectric device including a panel, formed of a thermally insulating material, and having a plurality of thermoelectric elements including compacted conductors inside the insulating material and expanded conductors outside the insulating material wherein the thermoelectric elements run substantially parallel to or at an acute angle relative to the long dimension of the panel. The thermoelectric device may be integrated into a variety of surfaces or enclosures needing heating or cooling with controls and configurations to optimize the application.

Integration of distributed thermoelectric heating and cooling

A thermoelectric device comprising an elongated panel, formed of a thermally insulating material, and having a plurality of thermoelectric elements comprising compacted conductors inside the insulating material and expanded conductors outside the insulating material is combined with other layers for leakage current interception, bodily fluid absorption, and pillars that preserve pressure re-distribution. The thermoelectric device may be integrated into a variety of surfaces or enclosures needing heating or cooling and manufactured using pre-existing automated equipment.

Medical, topper, pet wireless, and automated manufacturing of distributed thermoelectric heating and cooling

A thermoelectric device includes an elongated panel, formed of a thermally insulating material, and having a plurality of thermoelectric elements formed from compacted conductors inside the insulating material and expanded conductors outside the insulating material wherein the thermoelectric elements run substantially parallel to or at an acute angle relative to the long dimension of the panel. The thermoelectric device may be integrated into a variety of surfaces or enclosures needing heating or cooling with controls and configurations to optimize the application.

A device and method wherein a thermo electric generator device is disposed between stacks of a multiple level device, or is provided on or under a die of a package and is conductively connected to the package. The thermo electric generator device is configured to generate a voltage by converting heat into electric power. The voltage which is generated by the thermo electric generator can be recycled back into the die itself, or to a higher-level unit in the system, even to a cooling fan.

Method for heat dissipation on semiconductor device

A method and apparatus is provided for determining thickness of films or layers during chemical-mechanical planarization/polishing (CMP) of a semiconductor substrate or wafer in situ. The method may be used to determine end-point during CMP especially of oxide films deposited on the substrate or wafer. In one embodiment, the method includes: a) capturing images of the surface of the substrate using high speed imaging; b) performing pattern recognition on the captured images; c) selecting one of the captured images based on the pattern recognition; and d) converting the selected image into a thickness measurement. In one form, the high speed imaging comprises a high speed camera, while in another form, the high speed imaging comprises a conventional camera and a laser pulse or flash tube. In yet another embodiment, reflective laser interference patterns of the substrate are captured and analyzed for interference pattern changes that can signal a practical end-point.

Determination of film thickness during chemical mechanical polishing

A polishing pad having an upper layer with a first visual characteristic. The upper layer is adapted to erode against a pad conditioner at a uniform rate during a pad conditioning process. At least one lower layer with at least a second visual characteristic is disposed beneath the upper layer. The first visual characteristic is visually distinguishable from the second visual characteristic. The at least one lower layer is adapted to polish a substrate, where the visual distinguishability between the upper layer and the at least one lower layer provides a visual indication of whether the pad conditioning process has been accomplished in a uniform manner.

Visual wear confirmation polishing pad

A mask for use in a photolithographic process. The mask includes a plate or substrate having first and second opposite surfaces, a first image on the first surface of the substrate and a second image on the second surface of the substrate. When the mask is used in a photolithographic process, energy is reflected by the first image prior to entering the substrate and energy is reflected by the second image after passing through the substrate.

Apparatus and method to improve the resolution of photolithography systems by improving the temperature stability of the reticle

An electroplating tool for providing a metal or metal film on a semiconductor wafer during processing thereof has a wafer chucking mechanism with a conductor or conductors associated therewith. The conductor(s) are electrically connected to a controller that applies a voltage or current applied thereto for altering the position of and/or varying the intensity of electromagnetic field lines originating from a source anode of the electroplating tool. The electromagnetic field lines originating from the source anode direct the deposition of metal from the electroplating solution to the semiconductor wafer. The conductor(s) of the wafer chucking mechanism improve and/or modulate the electromagnetic field lines of the electroplating process. This provides greater control of metal deposition during the electroplating process such that uniformity of the metal (e.g. copper) is provided across the semiconductor wafer.

Electroplating tool for semiconductor manufacture having electric field control

Provided are systems and methods for overcoming optical errors occurring from reticle and other hardware usage in a semiconductor fabrication apparatus. The systems and methods minimize optical errors, such as those resulting from gravitational sag on a reticle or mask, for a pattern being projected onto a wafer. The reduced errors allow larger reticles and masks to be used&#x2014;while maintaining optical accuracy; and also improve optical budget management.

Optical error minimization in a semiconductor manufacturing apparatus

A pad groove analyzer and associated method configured to assess the grooves on the pad and determine how worn the pad is. The pad groove analyzer may be configured to monitor the grooves via a contact or no-contact process. In a contact process, the pad groove analyzer may include a stylus which physically contacts and moves along the pad. As the stylus falls into the grooves in the pad as the stylus moves along the pad, signals are created, and a stylus monitor uses the signals to determine to what extent the pad is worn. The stylus monitor can be configured to communicate with the general tool controller. In a no-contact process, the pad groove analyzer may take several different forms.

Method to monitor pad wear in CMP processing

A device for measuring resistances associated with electrical contacts of a contact ring used in a semiconductor wafer electroplating process. The device includes a substrate and a conductive pattern on the substrate. The conductive pattern is electrically contactable with the electrical contacts of the contact ring. Resistance measurement circuitry is connected to the conductive pattern. The resistance measurement circuitry is configured to send test signals to the conductive pattern, receive signals from the conductive pattern, and measure the resistances associated with the electrical contacts of the contact ring. A method of using such a device to measure resistances associated with electrical contacts of a contact ring used in a semiconductor wafer electroplating process is also provided.

Contact resistance device for improved process control

A method for inspecting the uniformity of the pressure applied between a conditioner and a polishing pad on a chemical mechanical polisher. A sheet of pressure sensitive material is placed between the conditioner and the polishing pad, and the conditioner is lowered onto the sheet of pressure sensitive material. A desired degree of pressure is applied between the conditioner and the polishing pad, thereby creating an impression in the sheet of pressure sensitive material, and the conditioner is lifted from the sheet of pressure sensitive material. The sheet of pressure sensitive material is inspected to determine the uniformity of the pressure applied between the conditioner and the polishing pad.

Pad conditioner setup

A method and apparatus which uses a plating electrode in an electrolyte bath. The plating electrode works to purify an electrolyte polishing solution during the electro-polishing process. Preferably, the plating electrode is employed in a closed loop feedback system. The plating electrode may be powered by a power supply which is controlled by a controller. A sensor may be connected to the controller and the sensor may be configured to sense a characteristic (for example, but not limited to: resistance, conductance or optical transmission, absorption of light, etc.) of the electrolyte bath, which tends to indicate the level of saturation. Preferably, the plating electrode is easily replaceable.

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West Linn, OR, United States of America

Michael J Berman