Westinghouse Electric Corporation

Northrop Grumman Systems Corporation

Michael J Ankrom

James A Rew

David L Schantz, Jr

James H DeOms

Ronnie L Starling

Charles S Kerfoot

William B Hall

Frank E Altoz

Frank A Lindberg

Geoffrey B Lansberry

Thomas C Underwood

Ngon B Nguyen

James L Munro

John J Buckley

Brian H Smith

Patricia A O'Donnell

Beth A Herman

Eric L Mohler

Richard M Young

Joseph J Springer

Marshall G Jones

William B Winkel

Todd M Zaranski

Brian A DeAbreu

Corey H Bowcutt

Walter M Downs

Aaron D Valdivia

An electric vehicle propulsion system having a motor with first and second electrically isolated windings and a system control unit for controlling the motor, wherein the system control unit includes a first power bridge for driving the first windings and a second power bridge for driving the second windings.

Electric vehicle propulsion system employing AC induction motor control

An electric vehicle relay assembly including a main relay and a flexible circuit electrically connected to the main relay. The relay assembly further includes a connection for mounting the flexible circuit onto the main relay and a wiring board affixed to the flexible circuit. The flexible circuit compensates for mechanical tolerance errors within the connection. The wiring board includes relay circuitry electrically connected to the flexible circuit.

Electric vehicle relay assembly using flexible circuit connector

A circuit trace/solder pad interface for closely spaced circuit traces is presented in which solder must be deposited to form a solder pad upon the circuit trace and the solder not migrate onto the circuit trace upon solder reflow. Through the intentional selection of solderably incompatible metals for the circuit trace and the solder pad, the solder pad may be isolated from the circuit trace thereby retaining solder on the pad. Furthermore a method for fabricating this circuit trace/solder pad interface is presented.

Solder pad/circuit trace interface and a method for generating the same

A method and an apparatus for depositing solder onto component lead pads of a printed wiring board. Solder preforms which are multi-layer, solder containing members are positively biased against the pwb pad which is then introduced into a vapor phase environment defining a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The pwb is heated according to a controlled process in which the temperature of the pwb is continuously monitored. The apparatus is a pressure fixture usable for vapor phase solder deposition of a pwb and comprises a first and a second member which are removably fastened together in an opposed relationship with a pwb is disposed between the first and the second members.

Method and apparatus for solder deposition

A method for vapor phase soldering components onto a PWB onto which solder has been previously deposited includes the steps of applying a fluxing agent on the PWB and introducing the PWB into a vapor phase environment. The application of flux is a multi-step process which includes a sequential application of flux to the PWB. The vapor phase environment defines a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The PWB is heated according to a controlled process in which the temperature of the PWB is continuously monitored.

Method for vapor phase soldering

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Baltimore, MD, United States of America

Michael J Ankrom