Tokyo Electron Limited

Michael Hummel

Merritt Funk

Yohei Yamazawa

Peter Ventzek

Mitsunori Ohata

Barton Lane

Chelsea Dubose

Justin Moses

Alok Ranjan

Jianping Zhao

Peter Lowell George Ventzek

Shyam Sridhar

Charles Schlechte

Qiang Wang

According to an embodiment, a plasma processing system includes a plasma chamber, an RF source, a matching circuit, a balun, and a resonating antenna. The resonating antenna includes a first and a second spiral resonant antenna (SRA), each having an electrical length corresponding to a quarter of a wavelength of a frequency of a forward RF wave generated by the RF source. The first end of the first SRA is coupled to a first balanced terminal of the balun and the second end of the first SRA is open circuit. The first end of the second SRA is coupled to a second balanced terminal of the balun and the second end of the second SRA is open circuit. The first and the second SRA are arranged in a symmetrically nested configuration having a same center point.

Balanced RF resonant antenna system

A radio frequency sensor assembly includes a sensor casing disposed around a central hole, the sensor casing including a first conductive cover and a second conductive cover. The assembly includes a cavity disposed around the central hole and includes a dielectric material, the cavity being bounded by a first major outer surface and a second major outer surface along a radial direction from a center of the central hole, where the first conductive cover is electrically coupled to the second conductive cover through a coupling region beyond the second major outer surface of the cavity, and electrically insulated from the second conductive cover by the cavity and the central hole. The assembly includes a current sensor electrically insulated from the sensor casing and including a current pickup disposed symmetrically around the central hole, the current pickup being disposed within the cavity and being insulated from the sensor casing.

RF voltage and current (V-I) sensors and measurement methods

A radio frequency (RF) system includes a RF power source configured to power a load with an RF signal; an RF pipe including an inner conductor and an outer conductor connected to ground coupling the RF power source to the load; and a current sensor aligned to a central axis of the RF pipe carrying the RF signal. A sensor casing is disposed around the RF pipe, where the sensor casing includes a conductive material connected to the outer conductor of the RF pipe. A gallery is disposed within the sensor casing and outside the outer conductor of the RF pipe, where the current sensor is disposed in the gallery. A slit in the outer conductor of the RF pipe exposes the current sensor to a magnetic field due to the current of the RF signal in the inner conductor of the RF pipe.

Various embodiments of molds and methods are disclosed herein for fabricating a radio frequency (RF) coil. The disclosed mold includes a cylindrical inner core having a first helically shaped groove formed within an outer surface of the cylindrical inner core, and a two-piece compression sleeve having a second helically shaped groove formed within an inner surface of the two-piece compression sleeve. When portions of the two-piece compression sleeve are attached together, the two-piece compression sleeve surrounds the cylindrical inner core and provide a compressive force to a conductor arranged within the first and second helically shaped grooves to fabricate the RF coil. In some embodiments, a three-dimensional (3D) printing process may be used to fabricate each piece of the mold separately.

Mold for forming a radio frequency (RF) coil for a plasma processing apparatus

A plasma processing system includes a plasma chamber configured to contain a plasma, a shutter chamber fluidically coupled to the plasma chamber via a first orifice, a mass spectrometer fluidically coupled to the shutter chamber, and a shutter disposed in the shutter chamber between the first orifice and the mass spectrometer in the path of a particle beam. The first orifice is configured to generate the particle beam from the plasma using a pressure differential between the shutter chamber and the plasma chamber. The mass spectrometer includes an ionizer configured to ionize species of the particle beam by sweeping through a range of electron energies in a plurality of energy steps. The shutter is configured to open and close during each of the plurality of energy steps.

Quantification of processing chamber species by electron energy sweep

A plasma processing apparatus includes a plasma processing chamber, a coil having an uncoiled length L disposed adjacent to the plasma processing chamber, and a plurality of retractable conductors each configured to make electrical contact with the coil in an extended position. A first tap position is located substantially at a distance L/2 measured from a first end along the coil, a second tap position neighboring the first tap position and located substantially at the distance L/2 measured from the first end along the coil, and a third tap position located substantially at the first end of the coil. A controller is configured to operate the plasma processing apparatus in a first operating mode to sustain an inductively coupled plasma and in a second operating mode to sustain a capacitively coupled plasma using subsets of the retractable conductors in the extended position.

Mode-switching plasma systems and methods of operating thereof

In one embodiment, a plasma processing system includes a plasma processing chamber, a substrate holder disposed in the plasma processing chamber, a coil disposed over the plasma processing chamber, and a plurality of taps configured to contact the coil at an associated contact region. The plasma processing system is configured to sustain a plasma by selecting a subset of taps from the plurality of taps to apply a power source and a reference potential.

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Austin, TX, United States of America

Michael Hummel