Intel Corporation

Michael Hui

Russell S Aoki

Anthony P Valpiani

Shelby A Ferguson

Jonathon Robert Carstens

Rashelle Yee

Joseph J Jasniewski

Nicolas A Kurczewski

Ralph V Miele

Thomas A Boyd

Daniel P Carter

Kevin Ceurter

Michael S Brazel

Harvey R Kofstad

Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes a cradle dock to allow the display portion to be removably connected to the keyboard portion in a first configuration, where a viewing angle of the display portion can be adjusted.

Stacking detachable tablet

Disclosed herein are integrated circuit (IC) packages with temperature sensor traces, and related systems, devices, and methods. In some embodiments, an IC package may include a package substrate and an IC die disposed on the package substrate, wherein the package substrate includes a temperature sensor trace, and an electrical resistance of the temperature sensor trace is representative of an equivalent temperature of the temperature sensor trace.

Integrated circuit packages with temperature sensor traces

Disclosed herein are apparatus, systems, and methods for warpage mitigation in printed circuit board (PCB) assemblies. In some embodiments, a PCB assembly for warpage mitigation may include: a PCB; an interposer disposed on the PCB, wherein the interposer has a first face and an opposing second face, the first face is disposed between the second face and the PCB, conductive contacts are disposed at the second face, solder is disposed on the conductive contacts, the interposer includes a first heater trace proximate to the conductive contacts, and, when a first power is dissipated in the first heater trace, the first heater trace is to generate heat to cause the solder disposed on the conductive contacts to melt; wherein the PCB includes a second heater trace.

Warpage mitigation in printed circuit board assemblies

Embodiments of the present disclosure describe package alignment frames for a local reflow process to attach a semiconductor package to an interposer. The frame may comprise a two frame system. The interposer may be on a mounting table or on a circuit board. The frame may include a body with a rectangular opening dimensioned to receive a semiconductor package to be coupled to the interposer. The frame may be to align a ball grid array of the semiconductor package with pads of the interposer. A second frame may be to receive the first frame and may be to align a ball grid array of the interposer with pads of the circuit board. A single frame may be used to couple a semiconductor package to an interposer and to couple the interposer to a circuit board. Other embodiments may be described and/or claimed.

Semiconductor package alignment frame for local reflow

A computer assembly comprising a computer assembly base for the computer assembly, a rotatable display screen support coupled to the computer assembly base configured to receive a display screen and an base stabilizer of the computer assembly base configured to extend from a back side of the computer assembly base, wherein upon extension is configured to provide counterbalance support to the computer assembly base to inhibit tipping.

Counterbalance system for computer assembly

Growing community of inventors

Tacoma, WA, United States of America

Michael Hui