Lumination LLC

Michael Hsing

Stanton Earl Weaver, Jr

Ivan Eliashevich

Srinath K Aanegola

Boris Kolodin

In a light emitting device, a light emitting chip () includes a stack of semiconductor layers () and an electrode () disposed on the stack of semiconductor layers. A support () has a generally planar surface () supporting the light emitting chip in a flip-chip fashion. An electrically conductive chip attachment material () is recessed into the generally planar surface of the support such that the attachment material does not protrude substantially above the generally planar surface of the support. The attachment material provides electrical communication between the electrode of the light emitting chip and an electrically conductive path (') of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.

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Sanchong, Taiwan

Michael Hsing