The Charles Stark Draper Laboratory, Inc.

Michael Holm

Maurice S Karpman

Matt Shea

A method for interconnecting a die on a substrate of an electronic package. The method includes the steps of forming a plurality of free-end wire bonds on the die, wherein the free-end wire bonds are upstanding from the die, and encapsulating the free-end wire bonds in an encapsulation layer. Planarizing the encapsulation layer is performed so that the free-end wire bonds are exposed for electrical connection. Interconnecting the free-end wire bonds is provided by applying an interconnection layer on the encapsulation layer.

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Cambridge, MA, United States of America

Michael Holm