Vistec Semiconductor Systems Gmbh

Michael Hofmann

Andreas Birkner

Wolfgang Vollrath

Christof Krampe-Zadler

Kurt Hahn

A device for evaluating defects in the edge area of a wafer () is disclosed. The evaluation may also be performed automatically. In particular, the device includes three cameras (), each provided with an objective (), wherein a first camera () is arranged such that the first camera () is opposite to an edge area on the upper surface () of the wafer (), wherein a second camera () is arranged such that the second camera () is opposite to a front surface () of the wafer (), and wherein a third camera () is arranged such that the third camera () is opposite to an edge area on the lower surface () of the wafer ().

Device and method for evaluating defects in the edge area of a wafer and use of the device in inspection system for wafers

An illumination mean for the inspection of flat substrates is disclosed. The flat substrate includes an upper edge area, a lower edge area and a front area. The illumination means is formed as an annular segment and comprises an opening into which at least the edge area of the flat substrate extends. A plurality of light sources are arranged on an annular segment in a housing. Inside the housing, a reflective element is provided so that the light from the light sources does not impinge perpendicularly on the upper edge area, the lower edge area and the front area of the flat substrate.

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Heuchelheim, Germany

Michael Hofmann