Osram Opto Semiconductors Gmbh

Osram Ag

Osram Opto Semiconductor Gmbh

Michael Hiegler

Georg Bogner

Günter Waitl

Herbert Brunner

Moritz Engl

Stefan Grötsch

Stefan Groetsch

Karlheinz Arndt

Simon Blümel

Thomas Zeiler

Matthias Winter

Markus Schneider

Monika Rose

Simon Bluemel

Manfred Wolf

Josef Schmid

Steffen Koehler

Stefan GRÖTSCH

Steffen KÖHLER

Rolf HÄNGGI

A lens arrangement for an LED display device includes a lens. The lens has a first lens surface and an optical axis. The optical axis penetrates the first lens surface of the lens. Furthermore, the lens arrangement includes a transparent transition body, which is firmly coupled with the lens on the first lens surface, which is more temperature-resistant than the lens and which has an optical axis that is parallel to the optical axis of the lens.

Lens arrangement and LED display device

A housing for an optoelectronic component which includes a carrier with a chip mounting surface is disclosed. An optical element which is produced separately from the carrier is applied to the carrier. The chip mounting surface and the optical element define a parting plane, the parting plane between carrier and optical element being arranged in the plane of the chip mounting surface. Also disclosed is an optoelectronic component having a housing of this type and a method for producing an optoelectronic component of this type.

Housing for an optoelectronic component, optoelectronic component and method for the production of an optoelectronic component

A radiation-emitting or -receiving semiconductor chipis soft-soldered for mounting on a leadframeover which a prefabricated plastic encapsulant, a so-called premolded package, is injection-molded. Through the use of a low-melting solderapplied in a layer thickness of less than 10 &#x3bc;m, the soldering process can be carried out largely without thermal damage to the plastic encapsulant

Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof

A leadframe, a housing, a radiation-emitting component formed therefrom, and a method for producing the component includes the leadframe having a mount part with at least one bonding wire connecting area and at least one electrical solder connecting strip into which a separately manufactured thermal connecting part, which has a chip mounting area, is linked. To form a housing, the leadframe is sheathed, preferably, with a molding compound, with the thermal connecting part being embedded such that it can be thermally connected from the outside.

Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component

An apparatus having a least one fixing element is specified, the fixing element being provided for fixing the apparatus to a housing body of an optoelectronic device and the apparatus being designed as a mount for a separate optical element.

Apparatus for an optoelectronic device and componnent having an optoelectronic device and an apparatus

A housing is specified for an electronic component having at least two connecting parts (), which are partially in contact with the housing. The conductivity of at least subareas of the housing are set in a defined manner and current paths through the housing are formed between the connecting parts. The housing thus has a defined resistance (), which is connected in parallel with an electronic component (), and provides ESD protection for the component ().

Housing for an electronic component

Growing community of inventors

Mutlangen, Germany

Michael Hiegler