International Business Machines Corporation

Stmicroelectronics Gmbh

Michael Hatzistergos

Ahmet Serkan Ozcan

Lindsey H Hall

Filippos Papadatos

Yiyi Wang

Paul Andrew Ronsheim

Dmitriy Shneyder

Jonathan Levy

Christopher Michael Molella

Vincent Vazquez

A method of forming a semiconductor device is disclosed. The method including providing a substrate with at least one insulating layer disposed thereon, the at least one insulating layer including a trench; forming at least one liner layer on the at least one insulating layer; forming a nucleation layer on the at least one liner layer; forming a first metal film on a surface of the nucleation layer; etching the first metal film; and depositing a second metal film on the etched surface of the first metal film, the second metal film substantially forming an overburden above the trench.

Method to improve semiconductor surfaces and polishing

A specimen handling apparatus is provided and includes a body in which a bore is defined and a needle having a tip portion and a bit, which is removably insertible into the bore with the tip portion at least partially exposed, the bore and the bit each being formed such that, when the bit is inserted into the bore, the needle is forced into one of first or second rotational positions relative to a long axis thereof.

Specimen handling apparatus

Growing community of inventors

Beacon, NY, United States of America

Michael Hatzistergos