Dow Global Technolgoies LLC

Michael H Mazor

Rajen M Patel

Mohamed Esseghir

Shaofu Wu

Robert L McGee

Mark T Bernius

James Keenihan

Robert J Cleereman

Ryan S Gaston

John A Naumovitz

Gerald K Eurich

Michael J Lesniak

Eric Baer

Mark Alan Barger

Joseph A Langmaid

Gary D Parsons

David G Bland

Joseph Dooley

Myron J Maurer

Michael J Radler

Joe A Langmaid

Prashant Sharad Shembekar

John N Naumovitz

Jeffrey M Hansbro

Craig S Buck

Jerry A Garcia

John E Lastovica, Iii

Elena Enache Pommer

Attiganal N Sreeram

Jai Venkatesan

Richard Cesaretti

John E Lastovica

Robert L Mcgee

John Naumovitz

Daniel S Woodman

The present invention is premised upon a connector device and method that can more easily electrically connect a plurality of PV devices or photovoltaic system components and/or locate these devices/components upon a building structure. It also may optionally provide some additional sub-components (e.g. at least one bypass diode and/or an indicator means) and may enhance the serviceability of the device.

Connector device for building integrated photovoltaic device

Electronic device module comprising an ethylene multi-block copolymer

A building structure includes a framework of: (a) metal studs having walls that define an interior channel; (b) a cellular backing material extending lengthwise within the interior channel of at least a portion of the metal studs; (c) a thermally insulating layer extending over multiple metal studs; (d) fasteners extending through the thermally insulating layer, through a wall of a metal stud and into the cellular backing material within the interior channel of the metal stud; and (e) a cladding attached to the framework of metal studs by means of the fasteners.

Wall structure with enhanced cladding support

An electronic device module comprising: Typically, the polyolefin copolymer is an ethylene/&#x2200;-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

Electronic device module comprising polyolefin copolymer

Multilayer foam-film composite structures in which the cells of at least one foam layer have an anisotropic orientation exhibit at least one enhanced property of toughness, tear resistance and puncture resistance in comparison with a foam-film composite structure alike in all aspects except for the anisotropic orientation of the cells of at least one foam layer.

Anisotropic foam-film composite structures

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Midland, MI, United States of America

Michael H Mazor