Motorola Corporation

Michael H Kaneshiro

Diann M Dow

Vida Ilderem

Vida Ilderem Burger

Jay Paul John

James Albert Kirchgessner

John W Steele

Richard W Mauntel

Michael P Masquelier

E James Prendergast

David L Stolfa

Ik-Sung Lim

Kevin M Klein

Phillip W Dahl

A method of manufacturing a heterojunction BiCMOS IC. ( ) includes forming a gate electrode ( ), forming a protective layer ( ) over the gate electrode, forming a semiconductor layer ( ) over the protective layer, depositing an electrically insulative layer ( ) over the semiconductor layer, using a mask layer ( ) to define a doped region ( ) in the semiconductor layer and to define a hole ( ) in the electrically insulative layer, forming an electrically conductive layer ( ) over the electrically insulative layer, using another mask layer ( ) to define an emitter region ( ) in the electrically conductive layer and to define an intrinsic base region ( ) and a portion of an extrinsic base region ( ) in the electrically conductive layer, and using yet another mask layer ( ) to define another portion of the extrinsic base region in the electrically conductive layer.

Method of manufacturing a heterojunction BiCMOS integrated circuit

A low voltage field effect transistor structure (20) is provided with a threshold voltage that is tolerant of process variations that alter the location of a source implant region (41). A first halo region (33) and a second halo region (36) are formed adjacent to source region (41) such that after subsequent thermal processing, a constant doping profile of opposite conductivity as source region (41) is formed in the channel region (23) adjacent the source region (41). The embodiments can be formed either adjacent to only the source region (41) to create a unilateral device, or the doping profile can be formed adjacent to both source region (41) and a drain region (40) to produce a bilateral device. An additional embodiment forms a second implant region in source region (41) to reduce junction leakage and capacitance.

FET with stable threshold voltage and method of manufacturing the same

Insulated gate field effect transistors (10, 70) having process steps for setting the V.sub.T and a device leakage current which are decoupled from the process steps for providing punchthrough protection, thereby lowering a subthreshold swing. In a unilateral transistor (10), a portion (37, 45) of a dopant layer (25, 30) between a source region (48, 51) and a drain region (49, 52) serves as a channel region and sets the V.sub.T and the device leakage current. A halo region (34, 39) contains the source region (48, 51) and sets the punchthrough voltage. In a bilateral transistor (70), both a source region (83, 86) and a drain region (84, 87) are contained within halo regions (75, 74, 79, 81). A portion (76, 82) of a dopant layer (25, 30) sets the V.sub.T and a leakage current, whereas the halo region (75, 79) sets the punchthrough voltage.

Method for fabricating insulated gate field effect transistor having

Insulated gate field effect transistors (10, 70) having independent process steps for setting lateral and vertical dopant profiles for source and drain regions. In a unilateral transistor (10) , portions (48, 50, 51, 55) of the source region are contained within a halo region (34, 41) whereas portions (49, 47, 52, 64) of the drain region are non contained within a halo region. The source region (60, 65) has a first portion (48, 51) for setting a channel length and a second portion (50, 55 ) for setting a breakdown voltage and a source/drain capacitance. The second portion (50, 55) extends further into the halo region than the first portion (48, 51). In a bilateral transistor (70), portions (84, 89, 90, 91) of the drain region (72, 87) are contained within halo region (75, 79 ).

Insulated gate field effect transistor and method for fabricating

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Phoenix, AZ, United States of America

Michael H Kaneshiro