Parker-hannifin Corporation

Other

The Cleveland Clinic Foundation

Chomerics, Inc.

Russell T. Lucia

John P. Kalinoski

John E. Soron

Michael H. Bunyan

George R. Watchko

Paul R. Vilandre

Rudolf I. Shvartsman

Michael H Bunyan

George R Watchko

John P Kalinoski

William I Flanders

William G Lionetta

Kent M Young

Miksa De Sorgo

Rudolf I Shvartsman

Paul R Vilandre

John E Soron

Russell T Lucia

Jonathan E Mitchell

Stephen J Coppola

Lawrence R Moschini

Steven L Thornton

Chi Hang Wu

Jonathan Bergin

Thomas A Clement

Rishi P Singh

Miksa deSorgo

John J Hannafin

Alfred W Greenwood

Deanna J Wright

Marc E LaRosee

Phillip Blazdell

Victoria Santa Fe

David P Hill

John Wrisley

Marc E Larosee

Thermal thermally conductive interfaces are used in electronic devices for heat transfer between, for example, the mating heat transfer surfaces of a heat-generating, electronic component, such as an integrated circuit (IC) chip, and a thermal dissipation member, such as a heat sink or spreader, for the conductive cooling of the electronic component. The thermally conductive interface includes a heat spreading material formed of a flexible, lamellar graphite material having a plurality of coarse perforations therein; and a coating of a thermally-conductive phase change material joined to the surface of the graphite material.

Thermal interface material

A deflectable gasket assembly for EMI shielding and environmental sealing is described. The gasket assembly is formed from an electrically-conductive mesh sheet positioned between adjacent conductive surfaces. A gasket is provided at the outer boundaries of the mesh sheet for environmental protection. The edge of the gasket has a branched sealing element extending above and below the gasket assembly for contacting the adjacent surfaces. The branched sealing element is deformable and can be used on external aircraft electronic components.

Deflectable conductive gasket with environmental seal

A contact electrode assembly for delivering at least one therapeutic agent into ocular tissue of a subject includes a flexible dielectric layer, a first electrode portion, and a second electrode portion. The flexible dielectric includes oppositely disposed first and second surfaces. The first electrode portion is disposed on the first surface of the dielectric layer. The second electrode portion is disposed on a portion of the second surface of the dielectric layer. The second electrode portion includes an interdigitated electrode having a first comb-shaped portion defining a first plurality of fingers and a second comb-shaped portion defining a second plurality of fingers. Each of the first electrode portion, the first comb-shaped portion, and the second comb-shaped portion is electrically connectable to a signal source.

Electrode assembly for delivering a therapeutic agent into ocular tissue

A composite gasket for sealing and EMI shielding is provided. The gasket has a resilient conductive mesh sheet embedded with an elastomer gel layer. The conductive mesh is corrugated to provide a series of repeating waveforms, providing the gasket with a lower deflection force, better corrosion resistance, and a higher EMI shielding capability. A second elastomer can be used around the edge portions of the gasket for improved abrasion resistance and increased tensile strength. A fiberglass sheet can be incorporated in the mesh for added reinforcement and support. The gaskets of the invention can be used on external aircraft components, such as external aircraft antenna mounts.

Encapsulated expanded crimped metal mesh for sealing and EMI shielding applications

A composite gasket for sealing, lightning strike protection and EMI shielding is provided. The gasket has a resilient conductive mesh sheet embedded with an elastomer gel layer. The conductive mesh is corrugated to provide a series of repeating waveforms, providing the gasket with a lower deflection force, better corrosion resistance, protection against lightning strikes and a higher EMI shielding capability. A second elastomer can be used around the edge portions of the gasket for improved abrasion resistance and increased tensile strength. A fiberglass sheet can be incorporated in the mesh for added reinforcement and support. The gaskets of the invention can be used on external aircraft components, such as external aircraft antenna mounts.

Encapsulated expanded crimped metal mesh for sealing, EMI shielding and lightning strike applications

An EMI shielding gasket having enhanced corrosion protection and force deflection is provided. The gasket has a body formed from an electrically conductive material with outwardly extending projections from one or both surface portions thereof. A non-conductive polymer gel is applied to the spaces between the projections for protection against corrosion. The gasket is particularly adapted for use in external aluminum aircraft surfaces which are exposed to harsh environmental conditions.

Low force deflection and corrosion resistant EMI gasket

The present invention discloses methods, materials and devices for facilitating electromagnetic/radiofrequency interference (EMI/RFI) shielding and thermal management in packaging circuits. More specifically, a method of packaging integrated circuits with improved thermal and EMI management, a process of treating a compound for use as a thermal interface and/or an EMI shield, and an EMI shielding and thermal management apparatus. More specifically, the present invention divulges methods and apparatuses for adjusting viscosity of a thermally and/or electrically conductive (or thermally conductive and/or electrically insulative), form-in-place, fully cured compound thereby rendering the compound dispensable. Further, a process of treating a compound for use as a thermal interface or/and an EMI shield is disclosed. The compound is an admixture of a particulate filler component and a pre-cured gel component. The process includes applying a shearing force on the compound, thereby rendering the compound dispensable.

Dispensable cured resin

A reactive foil assembly for the packaging and presenting of a reactive foil. The reactive foil assembly comprising a reactive foil, a film, a flex circuit and an adhesive. The reactive foil is placed above the film such that a portion of the reactive foil does not overlap with the film. The flex circuit is also placed above the film such that the flex circuit is operably coupled to the reactive foil. The reactive foil assembly is placed over a surface such that the film adheres to the surface with the help of the adhesive. The reactive foil is ignited by an energy pulse provided by the power source and delivered by the flex circuit coupled to the power source. An exothermic reaction of the reactive foil is initiated, which provides a molten foil available for joining of two objects.

Reactive foil assembly

A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.

Conformal thermal interface material for electronic components

A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a polymeric constituent forming a continuous matrix in the layer; and (b) a dispersed constituent forming discrete domains within the matrix, the domains being form-stable at normal room temperature in a first domain phase and conformable between the first and second heat transfer surface in a second domain phase, and the domains having a domain transition temperature above normal room temperature from the first domain phase to the second domain phase. The dispersed constituent may be a fusible, i.e., low temperature melting, metal or metal alloy.

Thermal management materials having a phase change dispersion

Application of a thermally and/or electrically conductive compound to fill a thermal and/or EMI shielding gap between a first and a second surface. A supply of a fluent, form-stable compound is provided as an admixture of a cured polymer gel component, and a particulate filler component. An of the compound is dispensed from a nozzle or other orifice under an applied pressure onto one of the surfaces which, when opposed, form the gap, or into the gap formed between the surfaces. The gap is at least partially filled by at least a portion of the dispensed compound.

Thermally or electrically-conductive form-in-place gap filter

A heat sink disposable on a heat transfer surface of a heat-generating source such as an electronic component. The heat sink includes a base portion and a body portion. The base portion has a first surface disposable on the heat transfer surface, and a second surface opposite the first surface. The body portion is joined to the second surface of the base portion and is formed of a stack of corrugated sheets of one or more metal foils arranged to form a cellular, honeycomb-like structure.

Lightweight heat sink

A polishing pad or other shaped article for the electrochemical mechanical polishing (ECMP) of a workpiece. The article includes an electrically-conductive compound which is formed into a layer. The compound is formulated as an admixture which includes a polymeric component forming a continuous phase in the layer, and an electrically-conductive filler component forming a discrete phase within the continuous phase. With the workpiece and the layer being electrically connected and with an electrical bias being applied between the workpiece and the layer, the bias being capable of activating an electrochemical reaction, the compound exhibits an overpotential for the activation of the reaction greater than the bias.

Polishing article for electro-chemical mechanical polishing

A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a liquid resin constituent; and (b) a particulate filler constituent. The liquid resin constituent may be an ethylene-propylene copolymer (EPM) or a terpolymer (EPDM) of ethylene and propylene and a diene which may be ethylidene norbornene (ENB) or dicyclopentadiene (DCPD).

High temperature stable thermal interface material

A thermally-conductive compound for forming a layer which is conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The compound is an admixture of a thermal grease component and a dispersed constituent forming discrete domains within the grease component, the domains being form-stable at normal room temperature in a first phase and conformable between the first and second heat transfer surface in a second phase, and the domains having a domain transition temperature above normal room temperature from the first phase to the second phase. The dispersed constituent may be a fusible, i.e., low temperature melting, metal or metal alloy.

Growing community of inventors

Chelmsford, MA, United States of America

Michael H Bunyan