Robert Boschgmbh

Michael Guyenot

Reiner Ramsayer

Friedhelm Guenter

Martin Rittner

Benjamin Hagemann

Michael Guenther

Jens Koenig

Rainer Holz

Sonja Dudziak

Franz Wetzl

Sabrina Rathgeber

Thomas Kalich

Christiane Frueh

Alexander Geissler

Andreas Fix

Rico Bauer

Dieter Donis

Thomas Herboth

Marc Fischer

Andrea Feiock

Bernd Hohenberger

Sebastian Fritz

Timo Herberholz

Istvan Denes

Roumen Ratchev

Matthias Grauer

A method for producing a sinter layer connection between a substrate and a chip resulting in an electric and thermal connection therebetween and in reduced mechanical tensions within the chip. The method produces a sinter layer by applying a multitude of sinter elements of a base material forming the sinter layer in structured manner on a contact area of a main surface of a substrate; placing a chip to be joined to the substrate on the sinter elements; and heating and compressing the sinter elements to produce a structured sinter layer connecting the substrate and chip and extending within the contact area, the surface coverage density of the sinter elements on the substrate in a center region of the contact area being greater than the surface coverage density of the sinter elements in an edge region of the contact area, and at least one through channel, extending laterally as to the substrate's main surface being provided towards the contact area's edge. A large-area sinter element is situated in the contact area's center region, and circular sinter elements is situated in a contact area edge region. The sinter elements may also have notches. Also described is a related device.

Method for producing structured sintered connection layers, and semiconductor element having a structured sintered connection layer

In a method for manufacturing a connecting contact for an electrode of an electrochemical store, the electrode having a first material, a contact element made of a second material is provided, the contact element having a section coated using the first material, and the coated section is electrically and mechanically connected to the electrode to manufacture the connecting contact.

Method for manufacturing a connecting contact for an electrode of an electrochemical store, method for manufacturing an electrochemical store, and electrochemical store

Laminated composite () comprising at least one electronic substrate () and an arrangement of layers () made up of at least a first layer () of a first metal and/or a first metal alloy and of a second layer () of a second metal and/or a second metal alloy adjacent to this first layer (), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (), a region with at least one intermetallic phase () is formed between the first layer and the second layer, wherein the first layer () or the second layer () is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melting temperature of the AgX, CuX or NiX alloy is greater than the melting temperature of the basic solder. The invention also relates to a method for forming a laminated composite () and to a circuit arrangement containing a laminated composite () according to the invention.

Laminated composite made up of an electronic substrate and a layer arrangement comprising a reaction solder

The invention relates to an electrical contact, particularly designed as a press-in pin () for a circuit carrier (). The press-in pin comprises at least one press-in zone () at which conductor traces () can be contacted. The press-in pin () is either made of solid aluminum material () or contains at least one aluminum material section () or is made of solid aluminum material () with a copper jacket coating ().

Press-in contact

In a method for fastening a planar substrate having an electric circuit at a mounting position on a mounting element, a holding arrangement acts upon the planar substrate to fasten it, an activatable expansion arrangement being used as the holding arrangement.

Method and device for fastening a planar substrate, having an electric circuit or the like, in a mounting position

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Ludwigsburg, Germany

Michael Guyenot