Intel Corporation

Michael Gregory Drake

Chia-Pin Chiu

Pramod Malatkar

Mohit Mamodia

Mark J Gallina

Kyle Yazzie

Naga Sivakumar Yagnamurthy

Rajesh Kumar Neerukatti

Joseph Bautista

Disclosed herein are integrated circuit (IC) packages with an electronic component having a patterned protective material on a face, as well as related devices and methods. In some embodiments, a computing device may include: an integrated circuit (IC) package with an electronic component having a protective material on the back face of the electronic component, where the protective material is patterned to include an area on the back face of the electronic component that is not covered by the protective material; a circuit board, where the IC package is electrically coupled to the circuit board; and a heat spreader, where the heat spreader is secured to the circuit board and in thermal contact with the area on the back face of the electronic component that is not covered by the protective material.

Integrated circuit packages with patterned protective material

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Phoenix, AZ, United States of America

Michael Gregory Drake