Marlow Industries, Inc.

Michael Giraud

Jeremy Mishler

A thermoelectric-based air conditioning system is provided. The system includes at least a first supply air channel and a separate second supply air channel disposed in a housing. The system also includes a first thermoelectric cooler (TEC) assembly forming at least a portion of the first supply air channel and configured to independently condition air within the first supply air channel. The system further includes a second TEC assembly forming at least a portion of the second supply air channel and configured to independently condition air within the second supply air channel. The system includes a printed circuit board (PCB) for each of the first and second TEC assembly, wherein each of the PCSs are configured to provide an electrical connection between a first TEC and a second TEC with each of the first and second TEC assemblies. The system further includes a mold substrate configured to over-mold the first and second TECs of the first and second TEC assemblies.

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Rowlett, TX, United States of America

Michael Giraud