Ford Motor Company Limited

Visteon Global Technolgoies, Inc.

Ford Global Technolgoies, LLC

Henkel Corporation

Visteon Global Tech., Inc

Michael George Todd

Andrew Zachary Glovatsky

Robert Edward Belke

Peter Joseph Sinkunas

Myron Lemecha

Jay DeAvis Baker

Daniel Phillip Dailey

Robert Edward Belke, Jr

John Trublowski

Cuong Van Pham

Richard Keith McMillan

Achyuta Achari

Brian J Hayden

Bethany J Walles

Lakhi Nandlal Goenka

Vivek Amir Jairazbhoy

Mark David Miller

Prathap Amerwai Reddy

Marc Alan Straub

Robert Joseph Gordon

Charles Frederick Schweitzer

Ram S Raghava

Lawrence N Crane

James T Huneke

Mark Stephen Topping

Victor V Zaderej

Rosa Lynda Nuno

Rexanne M Coyner

Tianmin Zheng

Bruce C B Chan

Mauricio Ciocler

Jorge D Santana

Gordon C Fischer

Mayank R Parikh

Alice D Zitzmann

Electronic packaging materials for use with Low-k dielectric-containing semiconductor devices are provided.

Electronic packaging materials for use with low-k dielectric-containing semiconductor devices

In accordance with the present invention, it has been discovered that the addition of organic acids provides improved performance properties to curable compositions, e.g., improved flux compatibility, improved flow properties, improved voiding properties, and the like. Accordingly, there are provided curable compositions having improved performance properties, methods for the preparation thereof, and methods employing same. Also provided are novel articles prepared using invention compositions.

Organic acid containing compositions and methods for use thereof

A method for making multi-layer electronic circuit boards having &ldquo;blind&rdquo; type apertures which may be selectively and electrically grounded and further having selectively formed air bridges and/or crossover circuits

Circuit board and a method for making the same

Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness and a bottom layer forming a second major surface opposed to the first major surface. Etch resists are disposed on the first and second surfaces corresponding to reverse images of desired conductor patterns. The first and second surfaces are thereafter etched and the photoresist removed. The laminate substrate is secured via a low modules adhesive layer to a major surface of a base. The middle layer of the laminate substrate is thereafter selectively etched so as to isolate selected portions of the first and second surfaces and to define inner connect regions therebetween having a height equal to the predetermined thickness.

Multi-layer printed circuit board and method of making same

A solderless method for assembling a semiconductor electronic flip-chip device to an electrical interconnecting substrate including the steps of forming a plurality of raised electrical contacts and plurality of contact pads. The pads correspond in number and physical location with the electrical contacts. The pads and contact mate when brought together. A quantity of plastic material is interposed between the electrical device and substrate. The plastic material is heated so that it softens and flows. The electronic device and substrate are urged together. The urging step displaces the molten plastic material from between the contacts and pads. The contacts and pads are jointed directly without any adhesive, solder or conducive filler therebetween to electrically interconnect the electronic device and substrate. The plastic material is allowed to cool whereby the electronic device and substrate are adhesively bonded together and electrically interconnected.

Solderless flip-chip assembly and method and material for same

A method of attaching a flexible plastic film having electronic circuit traces to a rigid plastic substrate. The film and substrate are made from different incompatible plastic materials that do not bond to one another and have different CTE. The use of different or incompatible materials is useful where the properties of the backing structure and film are selected to achieve different results. For example, the flexible film may be selected from a material that provides a high melting point to withstand soldering while the backing material is selected from a low-cost and light weight plastic material that has a lower melting point. The film has conductive traces on at least one surface thereof and a backing surface. A heat activated adhesive is applied to the backing surface. The film is placed within an open injection mold and the mold is closed. A hot plastic resin is injected into the mold adjacent the adhesive. The resin heats the adhesive above its activation temperature and causes the adhesive to bond to both the backing surface and the plastic resin. The resin is allowed to cool and the finished circuit assembly is removed from the mold.

Method of laminating a flexible circuit to a substrate

A three-dimensional multi-layer electronic device and method for manufacturing same, wherein the device comprises a three-dimensional substrate including a conductive trace on at least one surface of the substrate, a thin layer of dielectric material substantially covering a desired portion of the conductive trace(s) on the substrate, the dielectric layer including vias at selected locations, and applying a coating of conductive material on the dielectric layer and in the vias, and defining a conductive trace in the material to thereby form a multi-layer, interconnected three-dimensional electronic device. Additional layers of dielectric material and conductive traces may be similarly applied to create the desired number of circuit layers. Molded-in structural features, and/or vias may be defined in the appropriate layers to accommodate the attachment and/or interconnection of other electronic devices to the device.

Three-dimensional electronic circuit with multiple conductor layers and

An integrated lighting assembly (10) includes an injection molded housing that has a base (12) with first fastening elements (22) molded thereon, a cover (18) with second fastening elements (24) molded thereon, and a substrate (16) intermediate the base and cover. An electrical circuit (30) is formed on the substrate and a lighting element (32) is attached to the electrical circuit. A reflective cone (34, 36) surrounds the lighting element to intensify its light and direct light through a diffuser lens (28) formed on the base. A reflective wall (26) on the base reflects light emanating from the diffuser lens in a predetermined pattern. Metal for the reflective surface and electrical circuit is deposited in a single operation. The base and cover are connected to the substrate by living hinges. When the cover is folded onto the base, the first and second fastening elements snap together to form a three dimensional lighting assembly.

Integrated lighting assembly

An electrical circuit assembly which requires no solder processing, including an electronic component having terminations arranged on at least one of its surfaces, and a molded curviplanar substrate having circuit traces thereon and a cavity formed therein, wherein the cavity substantially conforms in shape with the electronic component. Proximate the cavity is a plurality of electrical contacts, arranged in matched relation with the respective terminations of the electronic component, with at least one of the electrical contacts being connected to at least one of the circuit traces on the substrate. The cavity and electrical contacts are dimensioned such that an interference fit is provided between the component's terminations and the electrical contacts, such that the component is held within the cavity when the component is placed therein. The component is disposed in the cavity such that its terminations are in physical and electrical connection with their respective electrical contacts.

Three-dimensional molded sockets for mechanical and electrical component

There is disclosed herein a printed circuit board, one embodiment of which comprises: a dielectric substrate 10; a solid metallic heat sink 16 attached to or embedded within the substrate; a cavity 18 formed generally in the substrate, wherein at least one wall 20 of the cavity is defined by a surface 17 of the heat sink 16; a component mounting pad 14 disposed on the substrate proximate the cavity; a predetermined volume of electrically insulative liquid 22 contained within the cavity; and a thermally conductive member 24 embedded within the substrate, the member 24 being in direct thermal contact with each of the mounting pad 14 and the liquid 22.

Method for cooling electronic components

A circuit board assembly is disclosed comprising a pair of three-dimensional substrates having integral, metallized connectors. The connector of the first substrate protrudes therefrom, while the connector of the second substrate is recessed therein. The geometries of the protruding connector and the recessed connector are different such that they deform when assembled to provide an electrical connection and a detachable physical connection. In one embodiment, the recessed connector has a parabolic cross-section and the protruding connector has a circular cross-section. A flexible molded edge connector for the circuit board assembly is also disclosed.

Three-dimensional molded circuit board having interlocking connections

A circuit board includes a substantially non-conductive substrate and first and second rigid sheets. The first sheet forms a grid pattern substantially encapsulated by the substrate, and a portion of the first sheet extends beyond a boundary of the substrate to form a first interconnection terminal. The second sheet is also substantially encapsulated by the substrate and has a portion which extends beyond the boundary of the substrate to form a second interconnection terminal. The second sheet acts as an electromagnetic interference shield, and also has a coefficient of thermal expansion less than a coefficient of thermal expansion of the substrate.

EMI protection and CTE control of three-dimensional circuitized

A method and apparatus for forming a rigid circuit board has a circuit board with a reduced thickness in a bend region. The bend region may have several layers of laminate and conductive material. The circuit board is heated to the glass transition temperature which allows the circuit board to become flexible. The apparatus has a clamping member and a stationary member. The clamping member uses a shape memory alloy actuator with a transition temperature about the same as the glass transition temperature of the laminate. The actuator is used to form the bend region to a predetermined shape around the stationary member. When the circuit board is cooled, the circuit board again becomes rigid in its predetermined shape.

Method for reworking a multi-layer circuit board using a shape memory

A three-dimensional multi-layer molded electronic device and method for manufacturing same, wherein the device comprises at least two molded, three-dimensional substrates having mating surfaces, each substrate including a layer of patterned conductive material on at least one surface and electrically conductive vias at selected locations of the substrate for interconnection of the conductive layers, wherein the substrates are electrically joined at their mating surfaces and the circuit layers are aligned and interconnected to form a multi-layer, three-dimensional circuit which may include molded-in structural features.

Growing community of inventors

South Lyon, MI, United States of America

Michael George Todd