Micron Technology Incorporated

Michael G Placke

Tony M Brewer

A chiplet-based system comprises a substrate including conductive interconnect and multiple chiplets arranged on the interposer and interconnected using the conductive interconnect of the substrate. A chiplet includes multiple columns of multiple input-output (I/O) channels and the I/O channels are connected to a block of I/O pads and each side of the chiplet includes multiple blocks of the I/O pads. The multiple blocks of I/O pads on the side of the chiplet are arranged symmetrically relative to a centerline of the chiplet and each block of I/O pads on the side of the chiplet is at a common distance from any adjacent block of I/O pads on the side.

Edge interface placements to enable chiplet rotation into multi-chiplet cluster

Memory devices may include a substrate supporting at least one semiconductor device thereon. The substrate may include an interface located proximate to an end of the substrate and sized, shaped, and configured to provide external electrical connection to the at least one semiconductor device. Hook-shaped engagement structures may be located proximate to, and laterally outward from, the interface, the engagement structures extending laterally beyond a longitudinal remainder of a lateral periphery of the substrate trailing the engagement structures. The end of the substrate may lack screw keep-outs. A carrier may include posts shaped, positioned, and configured to be positioned in throats of the hook-shaped engagement structures to secure the end of the substrate to the carrier. Sidewalls may extend longitudinally from a crossbar for placement along the remainder of the lateral periphery of the substrate.

Apparatuses including one or more semiconductor devices and related systems

Memory devices including a substrate supporting at least one semiconductor device thereon. The substrate includes an interface sized, shaped, and configured to provide electrical connection to the at least one semiconductor device, the interface located proximate to an end of the substrate. Engagement structures are located proximate to, and laterally outward from, the interface. The engagement structures extend laterally beyond a remainder of a lateral periphery of the substrate, each engagement structure comprising a first depth at a first portion of the engagement structure and a second, smaller depth at a second, laterally inward portion of the engagement structure. A carrier includes supports shaped, positioned, and configured to be positioned in the second portions of the engagement structures to secure the end of the substrate to the carrier.

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McKinney, TX, United States of America

Michael G Placke