Henkel Ag & Company, Kgaa

Purac Biochem Bv

Ingevity UK Ltd.

Michael G Harwell

Qiwei He

Charles Willard Paul

Yuhong Hu

Matthew L Sharak

Kenneth Edward Martin

Ju-Ming Hung

Maria Xenidou

Tahir Iqbal

Leisa A Ryan

Sam Louis Samuels

Justin A Mehaffy

Cynthia Cain

Wei Kong

Joanne Georgiana

Alethea Pollock

Sun Hee Lehmann

Martin Riswick

Patrick Hayes

Jennifer Plummer

He Qiwei

Ryan A Leisa

Qiwel He

The invention is related to fast setting, bio-based hot melt adhesive compositions and use thereof. The bio-based hot melt adhesive compositions are based on renewable-based feedstock, making them environmentally friendly, and particularly suitable for sealing cardboard case, carton, and cardboards.

Hot melt adhesive composition and use thereof

Disposable insole pads and use thereof are disclosed. The disposable insole pads are multilayer structures comprising a topsheet and a pressure sensitive adhesive, and optionally a backsheet, silicone coating and liner layers. The pressure sensitive adhesive layer allows the disposable insole pads to be positioned, repositioned and removed, making them well suited for daily use and disposal.

Disposable insole pads and use thereof

Hot melt adhesive compositions containing radial polystyrene-polyisoprene/polybutadiene block copolymer and use as elastic attachment adhesive in the manufacture of disposable absorbent elastic articles.

Elastic attachment adhesive containing radial block copolymer

Hot melt adhesive compositions containing hyper-branched SBS block copolymers and end use applications thereof. The hyper-branched SBS is characterized in having a ratio between light-scattering molecular weight (of non-di-block polymer) and GPC molecular weight (of non-di-block polymer) greater than 1.4 and having ratio between light scattering molecular weight molecular weight (of non-di-block polymer) and light scattering molecular weight molecular weight (of di-block polymer) greater than 5. The ratio between light scattering molecular weight MW (of non-di-block polymer) and light scattering molecular weight MW (of di-block polymer) also defines the number of arms for the hyper branched structure. The weight average molecular weight of each arm of the hyper-branched SBS block copolymer is less than about 100,000. These are multipurpose adhesives finding utility as packaging, labeling, construction and positioning adhesives, and are particularly well suited for use as elastic attachment adhesives in the manufacture of elastic-containing products, such as disposable absorbent elastic articles.

Hot melt adhesives containing styrene butadiene block copolymer

Low application temperature thermoplastic hot melt adhesives are particularly useful as elastic attachment adhesives. The adhesives have a viscosity at 275&#xb0; F. of less than about 8,000 cp, a yield stress of less than about than 80 psi and a creep performance for a bond made through strand coating of less than about 15%. Preferred are adhesives that have a creep performance for a bond made through spiral coating of less than about 25%.

Low application temperature elastic attachment adhesive

Adhesives comprising up to about 40 wt % of an ionomer can be applied at low temperatures and exhibit good bond strength. The adhesives are particularly useful as elastic attachment adhesives.

Ionomer-containing hot melt adhesive

A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120&#xb0; C. of below about 10,000 centipoises, a cube flow at 130&#xb0; F. (54&#xb0; C.) of less than about 300%, a DSC crystallization temperature of less than about 75&#xb0; C. and a storage modulus of less than about 1.0&#xd7;10dynes/cmat 10 rads/sec (25&#xb0; C.).

Low application temperature hot melt adhesive

Adhesive containing radial block copolymer

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Hillsborough, NJ, United States of America

Michael G Harwell