Battelle Memorial Institute

Samsung Display Co., Ltd.

Vitex Systems, Inc.

Michael G Hall

Gordon Lee Graff

Mark Edward Gross

Eric Sidney Mast

Peter Maclyn Martin

Ming Kun Shi

Paul E Burrows

John D Affinito

Wendy D Bennett

Charles C Bonham

Ming-Kun Shi

Nicole Rutherford

J Chris Pagano

Robert Walty

An edge-sealed barrier film composite. The composite includes a substrate and at least one initial barrier stack adjacent to the substrate. The at least one initial barrier stack includes at least one decoupling layer and at least one barrier layer. One of the barrier layers has an area greater than the area of one of the decoupling layers. The decoupling layer is sealed by the first barrier layer within the area of barrier material. An edge-sealed, encapsulated environmentally sensitive device is provided. A method of making the edge-sealed barrier film composite is also provided.

Method for edge sealing barrier films

An edge-sealed, encapsulated environmentally sensitive device. The device includes an environmentally sensitive device, and at least one edge-sealed barrier stack. The edge-sealed barrier stack includes a decoupling layer and at least two barrier layers. The environmentally sensitive device is sealed between an edge-sealed barrier stack and either a substrate or another edge-sealed barrier stack. A method of making the edge-sealed, encapsulated environmentally sensitive device is also disclosed.

A multilayer plastic substrate. The substrate comprises a plurality of thin film layers of at least one polymer, the plurality of thin film layers being adjacent to one another and having sufficient strength to be self-supporting, wherein the multilayer plastic substrate has an average visible light transmittance of greater than about 80%.

Multilayer plastic substrates

A barrier assembly. The barrier assembly includes at least one barrier stack having at least one barrier layer and at least one polymer layer. The barrier stack has an oxygen transmission rate of less than 0.005 cc/m/day at 23&#xb0; C. and 0% relative humidity, and an oxygen transmission rate of less than 0.005 cc/m/day at 38&#xb0; C. and 90% relative humidity. The barrier stack also has a water vapor transmission rate of less than 0.005 g/m/day at 38&#xb0; C. and 100% relative humidity. A method for making a barrier assembly is also disclosed.

Ultrabarrier substrates

An encapsulated display device. The device includes a substrate, an environmentally sensitive display device adjacent to the substrate, and at least one first barrier stack adjacent to the environmentally sensitive display device. The barrier stack encapsulates the environmentally sensitive display device. It includes at least one first barrier layer and at least one first polymer layer. The encapsulated display device optionally includes at least one second barrier stack located between the substrate and the environmentally sensitive display device. The second barrier stack includes at least one second barrier layer and at least one second polymer layer. A method for making an encapsulated display device is also disclosed.

Method of making encapsulated display devices

A method for plasma enhanced chemical vapor deposition of low vapor monomeric materials. The method includes flash evaporating a polymer precursor forming an evaporate, passing the evaporate to a glow discharge electrode creating a glow discharge polymer precursor plasma from the evaporate, and cryocondensing the glow discharge polymer precursor on a substrate as a cryocondensed polymer precursor layer, and crosslinking the cryocondensed polymer precursor layer thereon, the crosslinking resulting from radicals created in the glow discharge polymer precursor plasma.

Plasma enhanced chemical deposition with low vapor pressure compounds

Encapsulated display devices

An encapsulated organic light emitting device. The device may include a substrate, an organic light emitting layer stack adjacent to the substrate, and at least one first barrier stack adjacent to the organic light emitting device, the at least one first barrier stack comprising at least one first barrier layer and at least one first decoupling layer wherein the at least one first barrier stack encapsulates the organic light emitting device. There may be a second barrier stack adjacent to the substrate and located between the substrate and the organic light emitting device. The second barrier stack has at least one second barrier layer and at least one second decoupling layer. A method of making the encapsulated organic light emitting device is also provided.

Environmental barrier material for organic light emitting device and method of making

An encapsulated microelectronic device. The device includes a semiconductor substrate, microelectronic device adjacent to the semiconductor substrate, and at least one first barrier stack adjacent to the microelectronic device. The barrier stack encapsulates the microelectronic device. It includes at least one first barrier layer and at least one first polymer layer. The encapsulated microelectronic device optionally includes at least one second barrier stack located between the semiconductor substrate and the microelectronic device. The second barrier stack includes at least one second barrier layer and at least one second polymer layer. A method for making an encapsulated microelectronic device is also disclosed.

Semicoductor passivation using barrier coatings

An encapsulated organic light emitting device. The device includes a first barrier stack comprising at least one first barrier layer and at least one first polymer layer. There is an organic light emitting layer stack adjacent to the first barrier stack. A second barrier stack is adjacent to the organic light emitting layer stack. The second barrier stack has at least one second barrier layer and at least one second polymer layer. A method of making the encapsulated organic light emitting device is also provided.

A high temperature substrate having improved properties. The substrate is a polymer substrate having a glass transition temperature greater than about 120&deg; C., and at least one first barrier stack adjacent to the polymer substrate. The barrier stack includes at least one first barrier layer and at least one first polymer layer. A method for making the high temperature substrate with improved properties is also disclosed.

Smoothing and barrier layers on high Tg substrates

A barrier assembly. The barrier assembly includes at least one barrier stack having at least one barrier layer and at least one polymer layer. The barrier stack has an oxygen transmission rate of less than 0.005 cc/m /day at 23&deg; C. and 0% relative humidity, and an oxygen transmission rate of less than 0.005 cc/m /day at 38&deg; C. and 90% relative humidity. The barrier stack also has a water vapor transmission rate of less than 0.005 g/m /day at 38&deg; C. and 100% relative humidity. A method for making a barrier assembly is also disclosed.

Growing community of inventors

West Richland, WA, United States of America

Michael G Hall