Hewlett-packard Development Company, L.p.

Hewlett-packard Corporation

Michael G Groh

Chien-Hua Chen

Michael W Cumbie

Bo Song

Devin Alexander Mourey

Jong-Souk Yeo

Thomas R Strand

Zhizhang Chen

Stephen Christopher Kitson

Donald E Wenzel

William R Boucher

Yoocham Jeon

Bret Mchuron-Guss

Todd A Berdahl

Veronica Frances Burnett Krim

An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten μm and two hundred μm, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.

Molded structures with channels

A fluid-ejection die cartridge includes a cartridge body. The fluid-ejection die cartridge includes a fluid-ejection die fluidically attached to the cartridge body. The fluid-ejection die is to eject fluid. The fluid-ejection die cartridge includes a stamped nanoceramic layer on an exposed fluid-ejection nozzle plate of the fluid-ejection die attached to the cartridge body.

Fluid-ejection die with stamped nanoceramic layer

Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

Three-dimensional features formed in molded panel

A fluid ejection device can include a nozzle plate incorporating a non-coplanar surface. The non-coplanar surface can include a hydrophilic region of a hydrophilic material having a water contact angle from about 50&#xb0; to about 90&#xb0; and a hydrophobic coating including a hydrophobic material having a water contact angle from about 91&#xb0; to about 160&#xb0;.

Fluid ejection devices

At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.

Aspects of the present disclosure are directed to forming a layer of material on a print head. As may be implemented in a manner consistent with examples herein, a layer of material from a transfer film is pressed against a surface of a print head, in which the surface defines fluid nozzle openings that extend from the surface into the print head. Portions of the material pressed onto the surface are therein adhered to the surface and caused to wrap over edges of the surface extending around the openings. The transfer film is removed along with a thickness of the material pressed into contact with the surface that remains adhered to the transfer film, as well as some or all of other regions of the material over the openings. The remaining layer of the material on the surface is thus formed with a uniform thickness.

Uniform print head surface coating

Fluid feed paths having enhanced wettability characteristics are disclosed. An example printhead includes a nozzle to expel fluid therefrom, and a fluid feed path to fluidly couple a fluid source and the nozzle. Fluid feed path walls are composed of a first material having a first wettability characteristic and a second material having a second wettability characteristic. The second wettability characteristic differing from the first wettability characteristic. A coating is formed on at least a portion of the fluid feed path defined by the first material and the second material of the substrate. The coating to harmonize the first wettability characteristic and the second wettability characteristic.

Fluid feed path wettability coating

In some examples, a method of making a printhead flow structure includes bonding a flex circuit to a flexible carrier with a thermal release tape, placing a printhead die on the flexible carrier, and debonding the printhead flow structure including the flex circuit and the printhead die from the flexible carrier at a temperature below a release temperature of the thermal release tape by flexing the flexible carrier.

Flexible carrier for fluid flow structure

In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.

Process for making a molded device assembly and printhead assembly

An example system includes a flexible carrier and a printhead flow structure. The printhead flow structure includes a flex circuit including a carrier wafer and at least one printhead die electrically coupled to the flex circuit. The carrier wafer is bonded to the flexible carrier with thermal release tape, the thermal release tape to debond substantially completely from the flex circuit at a debonding temperature via bending of the flexible carrier.

An adhesive transfer method includes depositing an adhesive on a first substrate, transferring a layer of the adhesive from the first substrate to an intermediate substrate, and transferring adhesive from the layer of the adhesive to at least one area of a second substrate.

Adhesive transfer

In one embodiment, a display element includes a first electrode; a dielectric layer having recessed regions therein over the first electrode; a second electrode disposed on the dielectric layer; and a fluid with colorant particles within the display element, wherein a voltage signal applied to the first electrode and the second electrode controls movement of the colorant particles such that a first voltage signal provides a first optical state by compacting the colorant particles into the recessed regions and a second voltage signal provides a second optical state by spreading the colorant particles in the fluid.

In-plane electro-optical display

Electro-optical display systems are disclosed. An electro-optical display system may include a plurality of electrodes; a display volume containing a fluid having a plurality of colorant particles; a layer adjacent to or part of at least one electrode of the plurality of electrodes and configured to at least one of (i) reflect at least one wavelength of light and (ii) absorb at least one wavelength of light; and recessed regions configured to contain the plurality of colorant particles, wherein the plurality of electrodes are configured to selectively move the plurality of colorant particles between a compacted position in which all or nearly all of the plurality of colorant particles are in the recessed regions, and a spread position in which the plurality of colorant particles are spread across the display volume.

Growing community of inventors

Albany, OR, United States of America

Michael G Groh