Tyco Electronics Amp Gmbh

Tyco Electronics Logistics Ag

Tyco Electronics Raychem Gmbh

Michael Frisch

Ralf Ehler

Bernd Winkens

The present invention relates to a power unit comprising at least one power electronics module, a circuit carrier, which is connected to said power electronics module, and at least one heat sink, which is connected to said power electronics module, in order to dissipate heat. The invention also relates to an associated heat sink and a corresponding assembly method. In order to provide a power unit and an associated assembly method which allows improved dissipation of air heat, as well as adequate electrical insulation of the power modules and simplified implementation, the circuit carrier comprises at least one through hole. At least one contact extension located on the heat sink, which is at least partially received by the through hole. The contact extension of the heat sink is thermally contacted with the power electronics module by means of a heat-conductive material.

Power unit comprising a heat sink, and assembly method

The present invention relates to an integrated circuit system with at least one integrated circuit, a cooling body to dissipate the heat generated by the integrated circuit and a latent heat storage module having a latent heat storage medium. The latent heat storage module is thermally connected to the cooling body in order to temporarily store the heat generated by the integrated circuit and to convey it to the cooling body. The integrated circuit has at least one semiconductor component which is assembled on a substrate and the substrate is in direct thermal contact with the latent heat storage module.

Integrated circuit system with a latent heat storage module

An electronic module has a semiconductor arranged on a substrate. The semiconductor has an electrically conductive contact face on a side remote from the substrate. A contacting unit is configured to be at least partially elastically yielding. A support element is configured to press the contacting unit toward the substrate to make electrical contact. The contacting unit contacts the substrate and/or the contact face.

Electronic module

The power part and the logic part of the module are arranged on different substrates. The circuit board () of the logic part has a recess () in which the power substrate () is located and electrically connected to the logic part by wire bonding techniques ().

Intelligent power module

The power substrate is inserted in a housing ( ) as base plate and together with the same forms a standardized power part from whose top side ( ) there are projecting terminal pins ( ) which are soldered by through-soldering to via holes of the board ( ). The circuit board ( ), in a strip portion ( ) thereof that remains free, has contact pads ( ) as control and power terminals by means of which the module can be soldered directly into the slot-like opening of a system circuit board ( ).

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Munich, Germany

Michael Frisch