Bourns Incorporated

Michael Frederick Ehman

Ian Robert Harvey

Malcolm Randall Harvey

Larry L Eslinger

James Craig Stephenson

An inductive component includes a substrate on the surface of which is a lower insulation layer having a shallow concavity or trench, a first plurality of conductive elements formed in the trench, a magnetic core formed over the first plurality of conductive elements, and a second plurality of conductive elements formed over the core. The first and second pluralities of conductive elements are connected to each other so as to form an inductive coil around the core. First and second core insulation layers are disposed between the core and the first and second pluralities of conductive elements, respectively. The component is fabricated by a method in which it is built up in the trench using thin film techniques. A first array of conductors is patterned over the lower insulation layer, and a first core insulation layer is applied over the first conductor array. A magnetic core is formed on top of the first core insulation layer, and a second core insulation layer is applied over the core. A second array of conductors is patterned on top of the second core insulation layer so that the ends of the conductors in the first and second arrays contact each other to form an inductive coil around the core. The formation of either the first or second plurality of conductors may coincide with the formation of the metal conductor layer in the manufacture of a semiconductor integrated circuit, whereby the inductive component can be manufactured as part of the integrated circuit.

Integrated inductive components and method of fabricating such components

A multi-layered printed circuit board having a plurality of burried passive elements and a method for producing the circuit board wherein the passive elements can include resistors, capacitors and inductors. The method includes the steps of manufacturing individual layers of the multi-layer printed circuit board with electrical circuits thereon and subsequently screening polymer inks having resistive, dielectric or magnetic values to form the resistors, capacitors and inductors. Each layer of the circuit board is cured to dry the polymer ink and thereafter the individual layers are bonded together to form the multi-layer board.

Growing community of inventors

North Ogden, UT, United States of America

Michael Frederick Ehman