Johnson Matthey Inc.

Maxwell Electronic Components Group, Inc.

Space Micro, Inc.

Sony Corporation

Sony Electronics Inc

Maxwell Technologies, Inc.

Michael Featherby

David J Strobel

Edward Li

Phillip J Layton

Raymond L Dietz

Peter K Margetts

Carl S Edwards

Jennifer L DeHaven

Huizhen Zhu

In a surface inspection system for detecting particles on a surface, a light source mounted to illuminate the surface provides multiple wavelength ranges of electromagnetic radiation. An optical detector produces an image of the surface. An optical signal is produced indicative of returned electromagnetic radiation at each of a plurality of the multiple wavelength ranges from a field of view on the surface. A processor operating on the optical signals resolves presence of a contaminant as a function of the optical signals, and produces a contaminant signal responsive to presence of a contaminant. A heating means positioned to evolve contaminants from the surface is responsively coupled to be activated in response to a contaminant signal. The multiple wavelength ranges comprise ultraviolet, visible, and infrared wavelengths. The processor comprises means to perform false color contrast stretching.

Portable composite bonding inspection system

A composition for radiation shielding or range of compositions which compositions may be used for a variety of radiation shielding applications. With proper adhesive selection and processing, the construction forms an integral bond with the craft as compatible adhesives form strong bonds. This eliminates the potential for delaminating associated with the use of metallic layered shielding. While prior art protects electronics with a direct coating to electronic packages, this approach allows larger equipment systems, such as optics, or spectrometers, to be shielded.

Optimized nuclear radiation shielding within composite structures for combined man made and natural radiation environments

A hermetically coated device includes an integrated semiconductor circuit die, a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, a second layer, the second layer enveloping the integrated semiconductor circuit die. Formation of such device includes steps of providing an integrated semiconductor circuit die, applying a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, and applying a second layer, the second layer enveloping the integrated semiconductor circuit die.

Electronic device packaging

The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.

Methods and compositions for ionizing radiation shielding

Method for making a shielding composition

A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.

Method of bonding an electronic device to a ceramic substrate

Silver-filled glass

Growing community of inventors

San Diego, CA, United States of America

Michael Featherby