Texas Instruments Corporation

Michael F Brenner

Vincent C Lopes

Toan Tran

Seth Andrian Miller

A method of planarizing a layer of an integrated circuit. In one embodiment, a liquid film is applied over the layer, using extrusion coating techniques. In another embodiment, the layer itself may be applied as a liquid film, using extrusion techniques.

Planarization for integrated circuits

The method of protecting micromechanical structures during a wafer fabrication process. A protective layeris deposited to protect the fragile microstructures during a wafer separation process and a post separation cleanup process. Suitable protective layerstypically are plastic and tend to deform or delaminate when the wafer is sawn. The deformation of the protective overcoat during the saw process destroys the structures it is intended to protect. To prevent deformation of the protective layera brittle layeris deposited on the protective layerto hold the protective layer in place during the saw process. Cured photoresist is a suitable protective layer. The photoresist can be applied to the protective layer using standard processes and cured, typically by baking the photoresist. Once the wafer is separated, the brittle layer may be removed. After the debris created during the saw process is removed, the protective overcoat may be removed. The brittle layerand the protective overcoatmay be removed at the same time. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. &#xa7; 1.72(). In no case should this abstract be used for interpreting the scope of any patent claims.

Separating wafers coated with plastic films

A method for coating free-standing micromechanical devices using spin-coating. A solution with high solids loading but low viscosity can penetrate the free areas of a micromachined structure. Spinning this solution off the wafer or die results in film formation over the devices without the expected damage from capillary action. If an organic polymer is used as the solid component, the structures may be re-released by a traditional ash process. This method may be used as a process in the manufacture of micromechanical devices to protect released and tested structures, and to overcome stiction-related deformation of micromechanical devices associated with wet release processes.

Re-coating MEMS devices using dissolved resins

An improved process for manufacturing semiconductor devices (10). The device, which could be a semiconductor wafer, an individual chip, or a device that has integrated within it semiconductor devices, such as a compact disk drive, is placed or held upside down with its working surface (12) open. The device (10) is struck, causing particulates (18) attached to the working surface (12) to fall free of the device. Alternately, the device could be sharply decelerated to apply the shock. Additionally, the device could be held substantially vertical and rotated to use centrifugal force to separate the particulates away from the device.

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Dallas, TX, United States of America

Michael F Brenner