Ebm-papst Mulfingen Gmbh & Co Kg

Sig Technology Ag

Michael Eccarius

Ralph Wystup

Michael Sturm

Gunter Streng

Sven Beck

Ulrich Alef

Günter Haas

Erik Reichert

Sebastian Bundschuh

Kurt Dahlmanns

Claudius Dietzsch

Paul Mezger

Hendrik Mohr

Rainer HUNDSDÖRFER

The present disclosure relates to a cooling apparatus () comprising a metal and/or electrically conductive EMC enclosure () and a converter (E) and also a plurality of electrically operated units (E, . . . , E) within the EMC enclosure () which are designed to influence a local temperature in at least one region () inside or outside the EMC enclosure (), wherein the converter (E) directly supplies at least one or more of the units (E, . . . , E) with a respective supply voltage, and wherein the converter (E) and the units (E, . . . , E) are each designed such that the line-bound and/or field-bound interference (S) which is specifically generated by this unit during operation of the cooling apparatus () is compensated for by a line-bound and/or field-bound interference (S) of at least one of the respectively other units (E, . . . , E) partially or completely in terms of its respective interference level (P).

EMC cooling device

A fan includes a sealed electronics housing, in which a printed circuit board having electronic components is arranged. The electronics housing is divided into an upper region and a lower region. A cooling wheel which is arranged in the lower region is axially adjacent to the printed circuit board. The printed circuit board has at least one central opening and a plurality of peripheral-edge openings or gaps in order to bring the upper region into fluid communication with the lower region. Air is drawn out of the upper region into the lower region by the cooling wheel via the at least one central opening and, via the plurality of peripheral-edge openings or gaps. The air is fed back into the upper region. An air circuit having at least one air flow develops along a surface of the printed circuit board on which the electronic components are arranged.

Fan comprising a printed circuit board cooling circuit

Growing community of inventors

Mulfingen, Germany

Michael Eccarius