Smith + Nephew

Sequessome Technology Holdings Limited

Michael Earl

William Kelbie

Daniel Lee Steward

Joseph William Robinson

Frederick Jethro Harrison

Reece Knight

Grant West

David Peter Lloyd

Richard Wolf Garraway

Nicholas Baverstock

Saruhan Yurdakul

Disclosed herein are embodiments of a wound treatment apparatus with electronic components integrated within a wound dressing. In some embodiments, a wound dressing apparatus can comprise a wound contact layer, an absorbent layer over the wound contact layer, the absorbent layer comprising one or more apertures, a cover layer configured to cover and form a seal over the wound contact layer and the absorbent layer, and an electronics assembly comprising a negative pressure source. A portion of the cover layer overlying the one or more apertures in the absorbent layer can be configured to be compressed within the aperture in the absorbent layer when negative pressure is applied to the wound dressing apparatus. The compressed cover layer can indicate a level of negative pressure below the cover layer. In some embodiments, the wound dressing apparatus can comprise an indicator material layer and a cover layer configured to cover and form a seal over the wound contact layer and the indicator material layer. The indicator material layer can be configured to protrude relative to a surrounding surface of an upper surface of the wound dressing apparatus when negative pressure is applied to the wound dressing apparatus and the protruding indicator material layer indicates a level of negative pressure below the cover layer.

Negative pressure wound treatment apparatuses and methods with integrated electronics

Disclosed herein are embodiments of a wound treatment apparatus with electronic components integrated within a wound dressing. In some embodiments, a wound dressing apparatus can comprise a wound contact layer, an absorbent layer over the wound contact layer, the absorbent layer comprising one or more apertures, a cover layer configured to cover and form a seal over the wound contact layer and the absorbent layer, and an electronics assembly comprising a negative pressure source. The cover layer can be configured to be compressed within the aperture in the absorbent layer when negative pressure is applied to the wound dressing apparatus and indicate a level of negative pressure below the cover layer. In some embodiments, the wound dressing apparatus can comprise an indicator material layer configured to protrude when negative pressure is applied to the wound dressing apparatus and indicate a level of negative pressure below the cover layer.

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Beverley, United Kingdom

Michael Earl