Antaya Technologies Corporation

Aptiv Technologies Limited

Michael E Wheaton

William C Falk

Gordon Olson

Stephen C Antaya

M Jarod Scherer

John P Hendrick

Claudia Schulz

Claudia Schultz

Jarod M Scherer

A sensor device includes an emitter configured to emit radiation a detector configured to detect radiation reflected from an object and a cover having an interior surface facing the emitter or detector and allowing the radiation to pass through the cover. The sensor device also includes a heater with a wire-like trace directly deposited on the interior surface of the cover formed of a fluid comprising an electrically conductive material that was deposited onto a portion of the cover and cured. The heater has an electrically conductive connector pad formed with the heater by directly depositing and curing the fluid comprising the electrically conductive material directly on the interior surface of the cover simultaneously with forming the heater. The heater is positioned and arranged to sufficiently heat the cover while not blocking an area through which radiation must pass for proper operation of the emitter and the detector.

Object sensor including a deposited heater and method of forming same

A resistance soldering system includes a power input receiving an alternating current from a power source and a controller circuit generating a control signal indicative of a desired power level delivered for a desired time. The resistance soldering system further includes a silicon-controlled rectifier connected to the power input and the controller circuit and producing a control voltage proportional to the control signal and a transformer having a primary side receiving the control voltage and a secondary side having output leads configured to apply an output voltage to a solder joint disposed between the output leads. The controller circuit determines the control signal applied to the silicon-controlled rectifier required to melt the solder joint based on the desired power level and the desired time. The controller circuit controls the desired power level independent of the desired time. A method of operating a resistance soldering system is also presented.

Resistance soldering system

A power delivery system includes a power-input-channel, an AC/DC converter, one or more controller-circuits, a silicon-controlled-rectifier, a transformer, and a pair of output-leads. The power-input-channel receives alternating-current from a power-source. The AC/DC converter converts the alternating-current to a direct-current at a converter-output. The one or more controller-circuits are connected with the converter-output and control a signal indicative of a desired-power-level delivered for a desired-time. The silicon-controlled-rectifier is connected with the power-input-channel and controls an SCR-output-voltage to an SCR-output-channel proportional to the signal. The transformer reduces the SCR-output-voltage from a primary-side to a secondary-voltage on a secondary-side. The pair of output-leads are connected with poles of the secondary-side. A solder-joint is disposed between the pair of output-leads. The one or more controller-circuits determine the signal applied to the silicon-controlled-rectifier required to melt the solder-joint based on the desired-power-level and the desired-time, thereby melting the solder-joint disposed between the pair of output-leads.

An air-operated soldering device includes a pair of air cylinders which are operable to clamp a workpiece between the cylinders and a base. A clip holder is then advanced against the workpiece by a clip holder air cylinder. A pair of electrodes are then advanced against the workpiece by a pair of electrode air cylinders, and the electrodes are used to solder electrical contacts to the workpiece. An air operated position sensor is used as a limit switch to determine when the workpiece is properly positioned in the soldering device.

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W. Warwick, RI, United States of America

Michael E Wheaton