International Business Machines Corporation

Michael E Cropp

Candace A Sullivan

Donald W Diangelo

James C Utter

John Ulrich Knickerbocker

Jon Alfred Casey

Krishna Gandhi Sachdev

Glenn A Pomerantz

Robert J Sullivan

Daniel S Mackin

John F Harmuth

Bruce E Tripp

David E Speed

James N Humenik

Jawahar P Nayak

David Clifford Long

Michael A Cohn

John T Butler

Andrew H Vogel

John M Wargo

Charles W Hunter, Jr

Nancy A Wier-Cavalieri

Rao Venkateswara Vallabhaneni

Renee L Weisman

Kamalesh S Desai

Gerald H Leino

John A Trumpetto

Deborah Anne Sylvester

Nicholas L Volkringer

John J DeMarco

Phillip De Prado

Thomas A McPhee

Alberto H Gay

Carmella Pemberton

James M Blazick

Joseph Saltarelli

Frank V Ranalli

The present invention provides a method for controlling production or manufacturing costs by obtaining yield measurements of unit manufacturing for a multiplicity of products or production lines having a plurality of processes which includes determining a started units number for the plurality of processes. The method further includes determining a cost per unit for each unit of the plurality of processes, and calculating an expected approved units number for the plurality of processes. The expected approved units number is calculated by multiplying the started units number by an expected yield measurement. The method next includes calculating an actual approved units number for each of the plurality of processes by multiplying the started units number by an actual yield measurement, and calculating an unapproved units number for each of the plurality of processes by subtracting the expected approved units number from the actual approved units number. The method then includes calculating cost of yield measurements for the plurality of processes by multiplying the unapproved units number by the cost per unit, and providing a comparison of the cost of yield measurements for the plurality of processes.

Method of improving production through cost of yield measurement

This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.

Aqueous quaternary ammonium hydroxide as a screening mask cleaner

A process of forming a multi-layer feature on a ceramic or organic article in which first and second layers of paste are sequentially screened through a screening mask wherein the screening mask has not been moved between screening steps. A structure produced by this process is also disclosed.

Single mask screening process

An interface layer for separating first and second microelectronic ceramic substrates during firing includes a thermally degradable binder, preferably a polymer, that degrades at temperatures above room temperature and below a firing temperature for the microelectronic ceramic substrates, and a separating material, such as boron nitride or graphite. The method of making the interface layer includes mixing the binder, one or more solvents for the binder, a plasticizer and the separating material for a sufficient period of time to form a homogeneous mass, then casting the material in a thin sheet to form the interface layer.

Method of making an interface layer for stacked lamination sizing and sintering

A cleaning method and related apparatus for cleaning semiconductor screening masks using an aqueous alkali detergent solution applied under high pressure simultaneously from both sides of the mask, followed by a drying step that uses air knives to blow off the mask surface any residual cleaner solution.

System for cleaning residual paste from a mask

Deformation of vias and shorting between vias during screening of conductive paste onto greensheets wider than 185 mm is avoided by a concentration of thixotropic agent in the conductive paste formulation to a concentration which raises the thixotropic index of the paste to within 5% to 25% of the maximum achievable thixotropic index for the organic vehicle in the paste. For a paste containing molybdenum powder in which the organic vehicle is a mixture of ethyl cellulose, texanol and oleoyl sarcosine, this criterion corresponds to a concentration of glycerl tri(-12-hydroxystearate) in the range of 1.4% to 1.8% by weight.

Conductive paste for large greensheet screening including high

Optimized in-line mask cleaning system

Method of making an interface layer for stacked lamination sizing and

An improved method for screen printing fine lines of conductive paste on a substrate wherein a mask having a desired pattern of line shaped openings is placed on the substrate, and conductive paste screened in the openings in the mask in contact with the substrate, and also as a thin layer over the top surface of the mask. The mask is removed from the substrate before the conductive paste in the openings dries, thereby leaving a fine pattern of paste lines with a uniform height on the substrate.

Screen printing method for producing lines of uniform width and height

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Lagrangeville, NY, United States of America

Michael E Cropp