Optical Communication Products, Inc.

Michael Dudek

Carl W Embry

Timothy Bingaman

Mark Stiehl

Nelson Diaz

Dale Isaacson

Michael Tartaglia

Steven Anderson

John Hart Lindemann

David Galt

Craig Mynatt

Allen Tracy

Mark Eginton

In an exemplary embodiment of the present invention, an optical interface unit provides an interface between an optoelectronic device and industry standard MTP/MPO connectors. The optical interface unit axially aligns the core of a fiber with the optoelectronic device and interfaces that fiber to the standardized connector. In addition, the optical interface unit further provides a standardized interface for visible contact connection between the individual fiber stubs and the terminated fibers in the standardized connector. The optical interface unit therefore maximizes coupling from the optoelectronic device with the standardized connector.

Optical interface unit

A method and apparatus for driving lasers. An example laser driving system includes a laser current controller for providing a modulation signal and a bias signal. The modulation signal and bias signal is used by a plurality of high-speed current drivers that accept the modulation signal and the bias signal and produce a plurality of laser drive signals. The example system also has a disable input that disconnects power from a high-speed current driver when the high-speed current driver is not in use. The exemplary system develops the modulation and bias signals by feeding back a signal developed from detection of laser light from one of the lasers driven by the system. The laser may be a data laser or a control laser that is modulated by a signal having a lower frequency than the data lasers. If a control laser is used then the photodetector circuit used for feedback can have a lower frequency response because of the lower frequency of the control laser signal. The photodetector system may also employ a peak detector capacitor discharge circuit where a large capacitance is simulated by having the capacitor discharge through the base of a transistor have a current source in the emitter circuit.

High speed laser array driver

High-speed laser array driver

An optical communication system that includes a multi-channel post amplifier assembly with flexible output configurations for amplifying optical-to-electrical converted signals on selectable groups of amplifier channels is provided. The post amplifier assembly, when implemented on a single IC chip, is capable of operating with either the 2.5V or 3.3V of power supply. In addition, the IC chip containing the post amplifier assembly provides capability to selectively turn off one or more post amplifier channels during operation. Further, the post amplifiers provide integral auto zero function without requiring a use of external capacitors.

Post amplifier array integrated circuit

An opto-electronic device configured as a photodetector has a capacitor and/or resistor monolithically formed on a surface of the photodetector. The capacitor capacitively couples the AC ground of the photodetector to the bias terminal of the photodetector. The on chip capacitor design eliminates the inductance of external circuit traces between the power supply and an external capacitor. The resistor forces the AC return current of the photodetector through the AC ground in preference to the typical (DC bias terminal) path. Combinations of capacitors and resistors are particularly effective in reducing crosstalk among adjacent detectors in arrays.

High speed detectors having integrated electrical components

A method and apparatus for coupling light from an array of optoelectronic devices to a corresponding array of fibers contained in a fiber optic ferrule is disclosed. The fibers may be single-mode or multi-mode optical fibers. The method includes fixing the fiber optic ferrule to the optical subassembly (OSA) base upon which the array of optoelectronic devices will be affixed, aligning the array of optoelectronic devices to the corresponding array of fibers, then securing the array of optoelectronic devices to the OSA base. In one embodiment, the module includes an optical subassembly module housing a linear array of 1300 nm VCSELs or photodetectors, spaced apart at a 250 micron pitch to correspond to the spacing of optical fibers in a conventional MT ferrule. The array of optoelectronic devices is mounted on a substrate assembly that includes a weldable surface and one or more photodetectors for automatic power control. After the components are aligned, the substrate assembly is affixed to the OSA base by epoxying or welding. The material within the substrate assembly is transparent to the emitted light or includes a notch or hole that allows light to pass through, in order to facilitate the integral placement of the monitor within the substrate assembly and beneath the material.

VCSEL array optical subassembly module with alignment mechanism

Growing community of inventors

Longmont, CO, United States of America

Michael Dudek