Intel Corporation

Michael DiBattista

Richard H Livengood

Paul Winer

Gary Leonard Woods

Qing Ma

Valluri Ramana Rao

Li-Peng Wang

Seth Fortuna

Elizabeth B Varner

Randall C White

A method and apparatus for controlling the removal of material from a semiconductor substrate in an integrated circuit fabrication process is disclosed. The method and apparatus utilize a light source or charged particle beam (electron or ion beam) to induce a current in at least one P-N junction formed in the semiconductor substrate. The induced current is monitored during the removal of material and the process is stopped or endpointed in response to the induced current making a predetermined transition.

Method and apparatus for controlling material removal from semiconductor substrate using induced current endpointing

Nano-machining for circuit edits through the front side or backside of an integrated circuit may be performed using a scanning probe system. The system may create access holes with smaller dimensions and facilitate nano-machining endpoint detection in some embodiments.

Physical nano-machining with a scanning probe system for integrated circuit modification

A material may be removed from the top electrode of a film bulk acoustic resonator to alter the mass loading effect and to adjust the frequency of one film bulk acoustic resonator on a wafer relative to other resonators on the same wafer. Similarly, the piezoelectric layer or the bottom electrode may be selectively milled with a focused ion beam to trim the resonator.

Adjusting the frequency of film bulk acoustic resonators

An integrated circuit device is disclosed. The device comprises a die that has functional units on a first surface and a cooling system arranged adjacent a second surface opposite the first surface. The cooling system comprises a least one microchannel to contain a cooling liquid and to allow flow of the cooling liquid and at least one reservoir arranged adjacent to a region of the die. There is at least one valve between the reservoir and the microchannel to allow the cooling liquid to flow into the reservoir wherein flow of the cooling liquid depends upon a temperature of the die region.

Localized backside chip cooling with integrated smart valves

Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing

Growing community of inventors

Santa Clara, CA, United States of America

Michael DiBattista