Texas Instruments Corporation

Michael Dean Shilhanek

Danyang Zhu

Abha Singh Kasper

Zhuang Ma

Xinyu Yin

Steven Bolen

Albert Eardley

A multichip module (MCM) device include a first die including functional circuitry bonded by a plurality of inter-die bond wires (bond wires) to a second die having functional circuitry. A first channel (Channel A) and second channel (Channel B) each have separate top and bottom signal paths (signal paths) including one of the bond wires. A failure of any of the signal paths does not affect functionality of the device. The first die includes input pins including a first input pin (P), a second input pin (P), and coupling circuitry including cross-channel test circuitry positioned between the input pins and the functional circuitry. The coupling circuitry provides for Channel A and Channel B a first configuration for normal mode operation and a second configuration for test mode operation for single bond wire testing for checking continuity of any of the bond wires.

Growing community of inventors

Garland, TX, United States of America

Michael Dean Shilhanek