Ayar Labs, Inc.

Quintessent Inc.

Michael Davenport

Roy Edward Meade

Brian Robert Koch

Mark Taylor Wade

Alan Liu

Vladimir Marko Stojanovic

Rajeev J Ram

Milos A Popovic

Chen Sun

Derek Van Orden

Alexandra Carroll Wright

Justin Norman

Shahab Ardalan

Chong Zhang

Michael Lawrence Belt

The present disclosure is directed toward photonic elements comprising rib-waveguide-based ring resonators having high coupling efficiency between their bus and ring waveguides within the coupling region of the ring resonator, as well as operability over a wide spectral range. Embodiments disclosed herein employ a small-diameter ring waveguide and a bus waveguide that collectively define an asymmetrical coupler having a coupling region at which the optical confinement of the bus waveguide is stronger on side of the bus waveguide distal to the ring waveguide than on the side of the bus waveguide that is proximal to the ring waveguide. In some embodiments, in the coupling region, the bus waveguide has ridge and an inner bus-slab portion that is shared with the ring waveguide, while the outer bus-slab portion is at least partially removed to give rise to stronger optical confinement at the outer edge of the ridge of the bus waveguide.

Photonic systems comprising an asymmetric coupler and methods of fabrication

A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.

Fiber attach enabled wafer level fanout

Integrated-optics systems are presented in which an optically active device is optically coupled with a silicon waveguide via a passive compound-semiconductor waveguide. In a first region, the passive waveguide and the optically active device collectively define a composite waveguide structure, where the optically active device functions as the central ridge portion of a rib-waveguide structure. The optically active device is configured to control the vertical position of an optical mode in the composite waveguide along its length such that the optical mode is optically coupled into the passive waveguide with low loss. The passive waveguide and the silicon waveguide collectively define a vertical coupler in a second region, where the passive and silicon waveguides are configured to control the distribution of the optical mode along the length of the coupler, thereby enabling the entire mode to transition between the passive and silicon waveguides with low loss.

System comprising an integrated waveguide-coupled optically active device and method of formation

A substrate includes a first area in which a laser array chip is disposed. The substrate includes a second area in which a planar lightwave circuit is disposed. The second area is elevated relative to the first area. A trench is formed in the substrate between the first area and the second area. The substrate includes a third area in which an optical fiber alignment device is disposed. The third area is located next to and at a lower elevation than the second area within the substrate. The planar lightwave circuit has optical inputs facing toward and aligned with respective optical outputs of the laser array chip. The planar lightwave circuit has optical outputs facing toward the third area. The optical fiber alignment device is configured to receive optical fibers such that optical cores of the optical fibers respectively align with the optical outputs of the planar lightwave circuit.

Hybrid multi-wavelength source and associated methods

An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.

Laser module for optical data communication system within silicon interposer

Integrated-optics systems are presented in which an active-material stack is disposed on a coupling layer in a first region to collectively define an OA waveguide that supports an optical mode of a light signal. The coupling layer is patterned to define a coupling waveguide and a passive waveguide, which are formed as two abutting, optically coupled segments of the coupling layer. The lateral dimensions of the active-material stack are configured to control the shape and vertical position of the optical mode at any location along the length of the OA waveguide. The active-material stack includes a taper that narrows along its length such that the optical mode is located completely in the coupling waveguide where the coupling waveguide abuts the passive waveguide. In some embodiments, the passive layer is optically coupled with the OA waveguide and a silicon waveguide, thereby enabling light to propagate between them.

Optically active waveguide and method of formation

Aspects of the present disclosure are directed to wavelength division multiplexing systems comprising arrays of spectrally selective devices that are arranged on a substrate to compensate for perturbations of the spectral characteristics of the devices due to factors such as temperature non-uniformity, inherent spectral non-uniformity, and the like. As a result, shifts in the center wavelengths and/or changes in the wavelength spacing for the wavelength channels of a WDM system due to such perturbations are mitigated. In some embodiments, an array of spectrally selective devices is arranged on a substrate such that their respective wavelength channels are not linearly correlated with their physical position within the array, enabling the devices to be arranged in pairs that are subject to substantially the same environmental conditions and/or operate on nearly the same spectral range.

Growing community of inventors

Santa Barbara, CA, United States of America

Michael Davenport