Atmel Corporation

Michael D Whiteman

Bohumil Lojek

Amit S Kelkar

A method of non-thermal annealing of a silicon wafer comprising irradiating a doped silicon wafer with electromagnetic radiation in a wavelength or frequency range coinciding with lattice phonon frequencies of the doped semiconductor material. The wafer is annealed in an apparatus including a cavity and a radiation source of a wavelength ranging from 10-25 &#x3bc;m and more particularly 15-18 &#x3bc;m, or a frequency ranging from 12-30 THz and more particularly 16.5-20 THz.

Non-thermally annealed doped semiconductor material and methods related thereto

A method of forming a pre-metal dielectric film having good as deposited gapfill characteristics, as well as good mobile-ion gettering capability. The method involves first depositing a layer of high-ozone undoped silicon dioxide film having a high ozone/TEOS volume ratio. Then, a low-ozone doped BPSG film is deposited over the high-ozone undoped silicon dioxide layer. The film layers are heat treated to densify the film, and then the top layer is planarized using known planarization techniques to a thickness that allows for adequate mobile-ion gettering.

Method of forming pre-metal dielectric film on a semiconductor substrate including first layer of undoped oxide of high ozone:TEOS volume ratio and second layer of low ozone doped BPSG

A method of non-thermal annealing of a silicon wafer comprising irradiating a doped silicon wafer with electromagnetic radiation in a wavelength or frequency range coinciding with lattice phonon frequencies of the doped semiconductor material. The wafer is annealed in an apparatus including a cavity and a radiation source of a wavelength ranging from 10&#x2013;25 &#x3bc;m and more particularly 15&#x2013;18 &#x3bc;m, or a frequency ranging from 12&#x2013;30 THz and more particularly 16.5&#x2013;20 THz.

Non-thermal annealing with electromagnetic radiation in the terahertz range of doped semiconductor material

A method for preventing thermal stress and the shifting of alignment marks during semiconductor processing including providing a semiconductor wafer having a first selected portion for fabricating integrated circuitry and a second non-fabrication portion including alignment marks, introducing dopant into said first and second portions, when dopant is required to be introduced in said first portion, thereby increasing radiant energy absorptivity and decreasing radiant energy transmissivity in both portions such that the thermal emissions detected.at the portions result in no significant temperature variation between portions during heating. Therefore thermal stress and shifting of alignment marks are prevented.

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Woodland Park, CO, United States of America

Michael D Whiteman