Raytheon Company

Hughes Aircraft Company

Hughes Electronics Corporation

Michael D Runyan

Clifton Quan

Louis E Gates, Jr

David T Winslow

Scott T Johnson

Chad E Patterson

John J Wootan

James A Hathaway

R Thomas Walton

Michael L Turnage

A rotary joint includes a contactless electrical connection that has an annular shape, not extending into a central region surrounded and defined by the annular contactless electrical connection. The annular shape of the electrical connection portions allows other uses for the central region, such as for passing an optical signal through the rotary joint. Feeds are coupled to annular waveguide structures in both halves of the rotary joint, for input and output of signals. The feeds may provide connections to the annular waveguide structures at regularly-spaced circumferential intervals around the waveguide structures, such as at about every half-wavelength of the incoming (and outgoing) signals. The annular waveguide structures propagate signals in an axial direction, parallel to the axis of rotation of the rotary joint. The signals propagate contactlessly (non-electrically-conductively) across a gap in the axial direction between the two annular waveguides.

Rotary joint including first and second annular parts defining annular waveguides configured to rotate about an axis of rotation

A heat exchanger apparatus including a two-dimensional array of heat exchanging conduits, wherein each conduit includes an inlet and an outlet, and a manifold for providing heat exchanging fluid to the inputs of the heat exchanging conduits and for receiving heat exchanging fluid from the outputs of the heat exchanging conduits.

Heat exchanger

A method of manufacturing an environmentally robust electronic module for aircraft avionics or other military or commercial electronic systems. The method produces a sealed chip-on-board electronic module and comprises the following steps. A printed wiring board is provided having an electrical interconnection circuit printed thereon. Bare integrated circuit chips directly mounted and wirebonded to the printed wiring board. Solderable components are then mounted and conductively connected to the printed wiring board to produce a chip-on-board electronic module. The chip-on-board electronic module is then passivated with silicon nitride to produce a sealed chip-on-board electronic module. The electronic module is passivated by applying a coating of silicon nitride using a plasma enhanced chemical vapor deposition process at a temperature near room temperature so that no stress is induced in the integrated circuit chips or wirebonds of the electronic module. The silicon nitride coating typically has a thickness on the order of one-half micron. After passivation, the sealed chip-on-board electronic module is encapsulated or a cover is disposed thereon.

Method of constructing a sealed chip-on-board electronic module

The hermetic module (10) has a frame 12 with an integral heat sink panel (20) extending thereacross between the side walls (14, 16). High-density integrated circuit electronics are mounted on the heat sink panel by hybrid assembly techniques. Covers (36, 38) are welded to the walls to achieve closure. Feedthrough 74 includes connector block (84) extending through an opening in front bulkhead (76). The front bulkhead is Kovar clad, and seal is achieved by means of a Kovar flexible seal extending between the Kovar side of the front bulkhead and the Kovar ring on the connector block.

Totally enclosed hermetic electronic module

A carrier for an integrated circuit package is disclosed which comprises a base (30) suitable for receiving an integrated circuit package with unformed leads (20') or formed leads (20), a cover (60), flexible material (66), such as an elastomer, disposed between the cover (60) and base (30) surfaces, and pressure is maintained across the cover (60) and base (30) by way of finger (44) on a clip (40) on the base (30) engaging latching edges (68) of cover (60). The leads (22) of the integrated circuit package (20, 20') are thereby secured in position by the elastomeric material (66) which forms itself partially around each of the leads in response to pressure applied across the base (30) and cover (60) as hereinabove described. The disclosed invention eliminates the need for separate grooves or nests in the base (30) of the carrier for each lead of the integrated circuit package.

Growing community of inventors

Torrance, CA, United States of America

Michael D Runyan