Motorola Corporation

Michael D Prevallet

Philip Michael Lessner

Gregory Joseph Dunn

John D Prymak

Robert T Croswell

Remy J Chelini

Embedded capacitors comprise a bimetal foil () that includes a first copper layer () and an aluminum layer () on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side () opposite the first copper layer. The bimetal foil further includes an aluminum oxide layer () on the high surface area textured side of the aluminum layer, a conductive polymerlayer () on the aluminum oxide layer, and a second copper layer () overlying the aluminum oxide layer. The bimetal foil may be embedded in a circuit board () to form high value embedded capacitors.

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Mauldin, SC, United States of America

Michael D Prevallet